| Sign In | Join Free | My himfr.com |
|
... Ethernet and WIFIconnection.It can detect 5 moving persons at 4 meters within 0.7 seconds,IP64 level,work outdoor and mainly be designed for turnstile system. RA08 8 inch Dynamic Facial Recognition Screen D...
7 inch Semi Automatic Biochemical Analyzer Random access with10 incubators 3 timers Color LCD Touch screen Feature 7inch Color LCD Touch screen 10 incubators ......
Company Profile Infinites Tech, a subsidiary of CCFEX (China) LIMITED, is dedicated to the research and manufacturing of high-quality Computer memories solutions. The company specializes in the development of c...
Andriod Biometric Device Access Control System Products with Face Recognition Terminal RA05 is the new live face scan device, It can detect and track 5 persons simultaneously shown on the screen, and with flexi...
Andriod Biometric Device Access Control System Products with Face Recognition Terminal RA05 is the new live face scan device, It can detect and track 5 persons simultaneously shown on the screen, and with flexi...
Security semi-automatic waterproof three arm motor-free tripod turnstile suitable for outdoor Specifications of Tripod Turnstile Gate: Item Specification Power supply 100V TO 240V Power consumption 40W Access d...
...DYNAMIC RAM WITH EDO PAGE MODE Quick Detail: 1M x 16 (16-MBIT) DYNAMIC RAM WITH EDO PAGE MODE Description: The ISSI IS41LV16100B is 1,048,576 x 16-bit high-performance CMOS Dynamic Random Access Memories. Th...
...16-MBIT) DYNAMIC RAM WITH FAST PAGE MODE Description: The ISSI IS41C8205 and IS41LV8205 are 2,097,152 x 8-bit high-performance CMOS Dynamic Random Access Memory. The Fast Page Mode allows 2,048 random access...
DYNAMIC Random Access Memory DRAM 512K Bits SYNCHRONOUS Dynamic RAM IS42S32200L-7BLI FEATURES • Clock frequency: 200, 166, 143, 133 MHz • Fully synchronous; all signals referenced to a positive clock edge • Int...
.... Specification Of MT41K256M16TW-107 XIT:P Memory Organization 256M x 16 Memory Interface Parallel Clock Frequency 933 MHz Access Time 20 ns Voltage - Supply 1.283V ~ 1.45V Operating Temperature -40°C ~ 95°C...
...16-MBIT) DYNAMIC RAM WITH FAST PAGE MODE Description: The ISSI IS41C8205 and IS41LV8205 are 2,097,152 x 8-bit high-performance CMOS Dynamic Random Access Memory. The Fast Page Mode allows 2,048 random access...
Dynamic Random Access Memory DRAM 8Gb x16 x2 channel Mobile LPDDR4/LPDDR4X IS43LQ32256B-062BLI FEATURES • Configuration: - 256Mb x16 x 2 channels - 8 internal banks per channel • Low-voltage Core and I/O Power ...
Memory IC Chip MT53E256M16D1FW-046 WT:B 4Gbit Parallel DRAM LPDDR4 Memory Chips Product Description Of MT53E256M16D1FW-046 WT:B MT53E256M16D1FW-046 WT:B is 4Gbit Parallel DRAM LPDDR4 Memory IC. It is a high-sp...
Memory IC Chip W9825G6KH-6I 256Mbit Parallel High Speed SDRAM Memory IC 54-TSOP Product Description Of W9825G6KH-6I W9825G6KH-6I is a high-speed synchronous dynamic random access memory (SDRAM), organized as 4...
Memory IC Chip MT53E256M16D1DS-046 WT:B 4Gbit SDRAM Mobile LPDDR4 Memory IC VFBGA-200 Product Description Of MT53E256M16D1DS-046 WT:B MT53E256M16D1DS-046 WT:B is a high-speed CMOS, dynamic random-access memory...
Memory IC Chip MT53E384M32D2DS-053 AUT:E 12Gbit 1.866 GHz LPDDR4 Memory Product Description Of MT53E384M32D2DS-053 AUT:E MT53E384M32D2DS-053 AUT:E 12Gb Low Power SDRAM (LPDDR4) is a high-speed CMOS dynamic rand...
Memory IC Chip MT53E512M64D2NW-046 WT:B 32Gbit SDRAM - LPDDR4 Memory IC 432-VFBGA Product Description Of MT53E512M64D2NW-046 WT:B MT53E512M64D2NW-046 WT:B Low-power DDR4 SDRAM (LPDDR4) is a high-speed CMOS dyna...
... CMOS dynamic random access memory. LPDDR4 memory is optimized to address power consumption in battery-powered applications. Compared to DDR4, its peak bandwidth is 33% faster. Compared with standard DRAM, L...
Memory IC Chip MT53E1G64D4HJ-046 AAT:A Automotive 64G LPDDR4 Memory IC Product Description Of MT53E1G64D4HJ-046 AAT:A MT53E1G64D4HJ-046 AAT:A is a high-speed CMOS dynamic random access memory. LPDDR4 memory is ...
... CMOS dynamic random access memory. The memory device is designed in multi-chip package (MCP) and package stack (PoP) to save PCB space. The LPDDR4 memory device optimizes x16, x32, and x64 configurations to...