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...Thermal Silicone Conductive Pad 7.5W For AI Processors AI Servers Heat Dissipation The TIF®700PUS is an ultra-soft thermal interface material designed specifically to protect precision components that are ex...
High Compliance 1.5W Thermally Conductive Gap Filler Pads For AI Processors AI Servers Heat Dissipation The TIF®100-15-14S Series is a well-balanced, general-purpose thermal pad.It offers good thermal conductiv...
... Insulation High Performance Silicone-Based Thermally Gap Pad Filler For AI Processors AI Servers TIF®100-50-50E Series is a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivi...
...Thermal GAP PAD Materials For AI Processors AI Servers TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to ...
...Thermal GAP PAD Materials For AI Processors AI Servers Products description TIF®100-50-11U Series is an ultra-soft thermal interface material designed specifically to protect precision components that are ex...
Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers TIF®100-40-11E Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity...
...Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom The TIF®100-50-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are...
...Thermal Gap Pad For AI Processors AI Servers Computer CPU GPU Cooling The TIF®100-40-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are ext...
...Thermal GAP PAD Materials For AI Processors AI Servers Smart Home Telecom The TIF®100-50-11US Series is a thermal pad specifically designed to tackle the high level cooling challenges and environments sensit...
... and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, tra...
...Thermal GAP PAD Materials For AI Processors AI Servers Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We...
Custom Size Thicknesses Thermal Pad 1.8W/MK Thermal Management Materials For AI Processors AI Servers The TIF100-18-11E is not only designed to take advantage of the gap heat transfer, to fill gaps, complete t...
... to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit...
...Thermal Gap Filler Pad For AI Processors AI Servers Company Profile Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, d...
...) Discription: We are a professional Chinese export factory specializing in Halal Roasted Peanut Paste, with 225kg drum packing suitable for bulk industrial purchase — perfectly tailored to Malaysia’s food p...
...Paste is formulated to provide excellent flow properties, ensuring uniform coverage and optimal adhesion between the brazing surfaces. Its unique composition of silver, copper, and indium contributes to its ...
...Thermal Pad Thermal GAP PAD Materials For AI Processors AI Servers Product descriptions The TIF®100 2855-10 is a general-purpose thermal pad with balanced performance. It offers high thermal conductivity and...
... paste gel One-part pre-curing type Silicone thermal conductivity complex Product Features: High thermal conductivity 4W/m∙K Very small BLT and very low thermal resistance Soft adhesion and self-adhesive pro...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 4.0 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...
... thermally conductive compound Gray paste Non-curing type Product Features Thermal conductivity: 6.2 W/ m·K It contains metal powder to enhance thermal conductivity and non-insulating Very small interface th...