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Total 1346 products for bga package Manufacture & Suppliers

Iphone IC Chip APL1096/343S00474 Power Management Circuit BGA Package IC Chip

...BGA Package IC Chip Product Description Of APL1096/343S00474 APL1096/343S00474 is IC Chip - Power Management Circuit, BGA Package. Specification Of APL1096/343S00474 Part Number: APL1096/343S00474 Package...

ShenZhen Mingjiada Electronics Co.,Ltd.
China

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XC6SLX150-2FGG676I Programmable IC Chip 676-BGA Package Embedded FPGAs Abundant Flexible Logic Resources

...BGA Package Embedded FPGAs Abundant Flexible Logic Resources Number of LABs/CLBs 11519 Number of Logic Elements/Cells 147443 Total RAM Bits 4939776 Number of I/O 498 Voltage - Supply 1.14V ~ 1.26V Mounting T...

Shenzhen Sai Collie Technology Co., Ltd.
China

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ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication

Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Sp...

HongRuiXing (Hubei) Electronics Co.,Ltd.
China

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BGA Package Solder Paste DIP Turnkey PCB Assembly 700*460mm

BGA Package Solder Paste One Stop Service SMT DIP Turnkey PCB Assembly Box Build Technical Requirement for turnkey pcb ......

Chengdu Cesgate Technology Co., Ltd
Sichuan,China

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High Viscosity 3W/MK Thermally Conductive Putty For BGA Package

3W/mK thermal conductivity high viscosity thermally conductive putty for BGA package Company Profile Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal int...

Dongguan Ziitek Electronical Material and Technology Ltd.
Guangdong,China

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Black JEDEC Tray for BGA-Packaged Chip Complies With Standard Design Matrix 8x16=128PCS

Black JEDEC Tray That Holds The BGA-Packaged Chip Complies With Standard Design Product Description: JEDEC Trays: The Safest Way to Handle and Transport Semiconductor Devices When it comes to semiconductor devi...

Shenzhen Hiner Technology Co.,LTD
Guangdong,China

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0.1mm Stainless Steel Shim SMT Stencil PCB Assembly For BGA Package

SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x...

Bicheng Electronics Technology Co., Ltd
Guangdong,China

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MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package

MPC8260AZUPIBB MPU Microcontrollers and Processors BGA Package TYPE DESCRIPTION Categories Integrated Circuits (ICs) Embedded - Microcontrollers Series MSP430™ FRAM Packaging Tape & Reel (TR) Part Status Active...

Mega Source Elec.Limited
China

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New Original E1116AEBG-8E-F BGA Packaged Flash Memory

New Original E1116AEBG-8E-F BGA Packaged Flash Memory PRODUCT DESCRIPTION Part number E1116AEBG-8E-F is manufactured by ELPIDA and distributed by Stjk. As one of the leading distributors of electronic products,...

STJK(HK) ELECTRONICS CO.,LIMITED
China

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CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360

CSR8645B04-IBBC-R BGA Package Bluetooth Main Control Chip RF360 New Imported Original Spot Product Attribute Attribute Value Select Attribute ......

QIN XIN (HONG KONG) ELECTRONIC TECHNOLOGY CO.,LIMITED
China

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ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B ADI IC BGA Package

...BGA IC Integrated Circuits Components Specification :ADV7842KBCZ-5P ADV8003KBCZ-8 ADV8003KBCZ-8B Category Integrated Circuits (ICs) Product Name Electronic components Model number ADV7842KBCZ-5P ADV8003KBCZ-...

Angel Technology Electronics Co
Hongkong,China

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Original integrated circuit IC BGA Package electronic components CHIP RK3126

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ShenZhen QingFengYuan Technology Co.,Ltd.
China

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IPQ4019-0vv IPQ4019 IPQ4019-OVV BGA package network chip new original

...

G-Resource Electronics Co.,Ltd

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SMT Stencil Laser Cut 0.1mm Stainless Steel Shim for BGA Package with aluminum frame 520 mm x 420 mm x 20mm dimension

Product profile 1.1 General description This is a type of SMT stencil (100% laser cut) built on 0.10mm stainless steel foil with aluminum frame 520 mm x 420 mm x 20mm dimension. It��s fabricated per IPC 7525A us...

Shenzhen Bicheng Electronics Technology Co., Ltd
Guangdong,China

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35um BGA PCB Assembly

...permanently mount devices such as microprocessors. It can reduce package size and integrating a greater number of functions on a single chip module. BGA also replaces solder balls on the component underside ...

Shenzhen Shinelink Technology Ltd
Guangdong,China

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CNC Programmable BGA X Ray Machine 1000W For QFP PoP Package

CNC Programmable 1.0 kW X Ray Machine For SMT BGA QFP PoP Package Item S-7200 Panel Detector Pixel Pitch 85um Inspection area 600mmx600mm Detector Tile Angle 70 Degree X-......

Shenzhen Wisdomshow Technology Co.,ltd
Guangdong,China

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Customizable BGA Test Socket Housing Machining Center Probe Test Socket for High-Frequency Devices

...package, on any pitch (or multiple pitch) from 0.2mm or greater, in any configuration, with little or no tooling charge or extra lead-time. For Test & Burn-In of CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SS...

Krunter Future Tech (Dongguan) Co., Ltd.
China

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High Definition Industrial Touch Screen BGA rework station HS-700

...BGA's full name is BallGridArray, it is in the bottom edge of the package body substrate to make an array of solder ball as the I/O end of the circuit and the printed circuit board (PCB) interconnection.BGA ...

Shenzhen Hansome Technology Co., Ltd.
Guangdong,China

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