Transparent Low Viscosity Potting Compound Flexible PU potting ODM 315
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Clear PU Potting Compound with 3-Year Anti-Yellowing for Nameplate Applications Product Description BZ-315 is a highly transparent, yellowing-resistant polyurethane potting material formulated for surface coating on labels, nameplates, and printed graphics......
Guangzhou Baizhuang New Material Co., Ltd.
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Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/M·K | Moisture Resistant
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Low Viscosity Potting Gel HN-8820 | 1:1 Mix | 2.0 W/m·K | Moisture Resistant Product Overview for Thermally Conductive Potting Compound: HN-8820 low-viscosity potting gel ensures deep penetration and complete encapsulation. With 2.0 W/m·K thermal conductivity, it protects components from heat and humidity. Performance Highlights for Thermally Conductive Potting Compound •Low viscosity......
Shenzhen Hanast New Material co.,LTD
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6202 (HT6202T) Epoxy encapsulation electronic components , black potting compound
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...curing epoxy potting adhesive is for Automobile ignition coil potting 202 (HT6202T) double component heat curing epoxy potting adhesive is two components, heating curing, translucent, automobile ignition coil epoxy adhesive. Low viscosity, easy penetration......
Shanghai Huitian New Material Co., Ltd
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3M Scotch Weld DP270 Low Viscosity Epoxy Potting Compound for Electronic Components
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...Clear and Black variants. It features a 1:1 mix ratio by volume, 60-70 minute worklife at 23°C, designed for potting, sealing, and encapsulation of electronic components with negligible exotherm and non-corrosive to copper. Product Description DP270 is...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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Low Viscosity Fast Processing Potting Sealant For LED Lighting
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SLF385 Low Viscosity Silicone Encapsulant Potting Compound For Fast Processing Dark (Gray+White) Use For LED Lightings Low Viscosity Fast Processing Potting Sealant For LED Lighting DESCRIPTION SLF385 silicone 1 to 1 encapsulants are supplied as two-part ......
GUANGZHOU BAIYUN TECHNOLOGY CO., LTD.
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White 1.2W/mK Two Compound Thermally Conductive Potting Compound for Electronic Component
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...Compound Thermally Conductive Potting Compound for Electronic Component TIS™680-12AB Series is a two-part silicone potting adhesive with high thermal conductivity, room temperature curable,long working time and firere sistance.lt is especially suitable for capacitor, small electronic equipment sealing. Its flexible, elastic characteristics enable it to provide cushioning for the materials it is coated with. The lower viscosity...
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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2.5W/MK Low Viscosity Epoxy Heat-Conducting Potting Compound -40℃-160℃ Service Temperature
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2.5W/MK Low Viscosity Epoxy Heat-Conducting Potting Compound -40℃-160℃ Service Temperature Products description TIE®280-25AB is a two-component epoxy resin sealantwithgood thermal conductivity and ......
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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High Molding Pressure Urea Moulding Compound Low Viscosity High Flexural Strength
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...Compound Low Viscosity High Flexural Strength Product Description: Urea Moulding Compound is an amino moulding compound made from urea and other additives. It has a low viscosity, allowing for easy molding, and a molding temperature range of 150-210℃. The compound......
Dongxin Melamine (Xiamen) Chemical Co., Ltd.
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Indoor electrical insulator potting compound two component epoxy resin liquid
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...-viscosity solvent-free modified polyol. Indoor electrical insulator potting compound two component epoxy resin liquid Applications Indoor electrical insulators for medium and high voltage applications, such as insulators, dry-type ......
Shanghai Wenyou Industry Co., Ltd.
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Low Viscosity Electronic Adhesive Glue Waterproof Adhesive Potting
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... flexibility,good abrasion strength,good yellowing resistance,light color and Low VOC,Chemical resistance Description: Epoxy resin AR84 A/B is an epoxy resin adhesive that cures under normal and low temperature conditions. It has a high hardness, can be...
Chongqing Aorun Industrial Co., Ltd.
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