Professional Manufactured High-efficiency Thermal Interface Material Thermal Gap Pad For Automotive Electronics
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...Thermal Interface Material Thermal Gap Pad For Automotive Electronics Company Profile Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal......
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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TIF100-50-11S CPU Thermal Pad Silicone Thermal Interface Material 5.0W RoHS Compliant For Cooling Of Automotive Electronics
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...the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink. Their flexibility and...
CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics
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Thermal Interface Material , Thermal Conductive Silicone Gap Filler Pad For Electronics A-gapfill 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in combination with extreme softness produces incredibly low thermal......
Adcol Electronics (Guangzhou) Co., Ltd.
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Thermal Conductive Pad Silicone Thermal Interface Material For In LED Lit Lamps And Electronic Heat Sinking Applications
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Thermal Conductive Pad Silicone Thermal Interface Material Designed for LED lighting systems and electronic heat sinking applications, the TIF®800 Series provides optimal thermal management solutions for various industrial and electronic applications. Company Overview Ziitek is a high-tech enterprise specializing in the research, development, manufacturing, and sales of thermal interface materials......
Dongguan Ziitek Electronical Material and Technology Co., Ltd
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TIM Thermal Interface Materials Electronics Thermal Phase Change Material ROHS
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.... With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 35µm...
ZSUN CHIPS CO., LTD
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180cc High Thermally Conductive Single Part Fillers Thermal Interface Material for LED
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High Thermally Conductive Single Part Fillers Dispensable Material for LED Discription of Thermally Conductive Single Part Fillers: Thermally Conductive Single Part Fillers is a silicone resin as the base material, adding thermally conductive fillers and ......
Trumony Aluminum Limited
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5274 Two-Part Thermal Gel Enhanced Heat Dissipation In New Energy Vehicles With Thermal Interface Materials
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5274 TDS-EN.pdf 5274 is a two-component silicone thermal conductive gel, which be able to cure at room temperature or accelerate curing at high temperature Product Description Silicone thermal conductive composite Blue/white gel 1:1 mixture of two ......
Shanghai Huitian New Material Co., Ltd
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High-Purity White D50 Spherical Alumina Powder with 3.60 g/cm³ Specific Gravity for Thermal Interface Materials
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...Thermal Interface Materials This premium spherical alumina powder features exceptional globularity and high thermal conductivity, manufactured through advanced high-temperature melting technology. With its unique spherical morphology and high α-Al₂O₃ content, it delivers superior performance as a functional filler in thermal interface materials......
Shaanxi KeGu New Material Technology Co., Ltd
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ShinEtsu X-23-8117 High Conductivity Thermal Interface Material with 6.2 W/m*K for Semiconductor Grade Screen Printing Grease
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... with a pre-flash viscosity of 80 Pa·s, post-flash viscosity of 700 Pa·s, thermal conductivity of 6.2 W/m·K, thermal resistance of 6.1 mm²·K/W, and bond line thickness of 26 μm. Product Overview Optimized for screen printing, stencil printing,...
Shenzhen Huazhisheng New Material Technology Co., Ltd.
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Automotive Electronics Thermal Conductive Gap Filler
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3.0W/m.K Thermal Conductivity Silicone Gap Filler For UAV With 2.9g/Cc Density Attribute Value Test Method Composition Ceramic filler + Silicone - Color Green Visual Density(g/cc) 2.9 ASTM D792 Extrudability(g/s) 5.0 ISO9048 Usage Temperature(℃) -40~150......
Shenzhen Aochuan Technology Co., Ltd
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