ENIG Wire/die Bond BGA package Substrate IC Packaging Substrate fabrication
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Application:IC substrate package,Wifi module/Bluetooth module,Memory package,Memory packaging substrate,Dram/SSD/LPDDR package substrate,IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/......
HongRuiXing (Hubei) Electronics Co.,Ltd.
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Sensor IC Substrate PCB With Components 18 Layer Circuit Board Maker
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... / line spacing: 120 / 25um Surface technology: ENEPIG Plate thickness: 0.25mm Purpose: BGA IC packaging substrate Customized PCBs, also known as bespoke or tailor-made PCBs, are designed to meet specific requirements of a particular project, application,...
ONESEINE TECHNOLOGY CO.,LTD
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TG140 HDI Half Hole PCB 4 Layer FR4 Substrate 100 Ohm
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...Substrate Board Info: 1 Part NO: Half hole PCB0013 2 Layer Count: 4 Layer PCB 3 Finished Board Thickness: 0.8 MM tolerance is +/-0.1MM 4 Solder Mask: Green 5 Min Lind Space&Width: 6/6 mil 6 Application Area: Blue-tooth Module 7 Drillings: L1-L4 0.2MM Mechanical Drilling 8 BGA Size: 0.25MM......
Witgain Technology Limited
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64 Feeders 6 Head Placement 500W PCB SMD Assembly Machine
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... substrate and strip lights. The finished products can be used in producing resistor-capacitor, glass cylinder package diode, triode, TQFP package, QFN package, QFP package, BGA package, lamp pole etc. Technical parameters Maximum mounting ......
Beijing Silk Road Enterprise Management Services Co.,LTD
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