TIS-30FIP Series Elastomer Gasket Material For Optical And Medical
Component Adhesive
TIF-30FIP is a Nickel Graphite filled silicone paste with very low hardness
which contributes to relatively low compression force when it is
used as dispensed gaskets in between of chassis and cover. lt is
also designed to beused under high compression rate up to 60% so
that the gaskets can compensate large tolerance of substrates. lt
also has good shielding performance with balanced mechanical
properties.This grade end in a very cost effective FIP solution
through its low density and fast dispensing speed.Ziitek's
Form-In-Place is an automated system for dispensing conductive
elastomer EMl shielding and grounding gaskets onto metal or plastic
substrates.This product is particularly ideal for base stations,
PDAs, PCcards, radios, mobile phones, as well as many other cast or
plastic enclosures and packaged electronic assemblies.
FEATURES AND BENEFITS
>Form-in-place gasketing offers a totalcost savings in the form
of reduced raw materials, labor or assembly time
> Room temperature cure gasketingmaterials eliminate the need
for costly heat curing systems, allowing the use ofinexpensive
plastic or metal substrates
>Single-component compounds eliminate the need for
mixingingredients, thereby shortening production cycles and
eliminating related waste
>Easy to program operating system allows for quick part-topart
change-over,minimal tooling investment for new designs, and
prototype development in 24 to 48 hours
>Low compression force makes SN compounds an excellent selection
wherethe mating surfaces lack mechanical stiffness Form-in-place
gaskets provide morecritical packaging space for board level
components and smallerpackage dimensions
>High shielding effectiveness:85~100dB up to 10GHz
Applications
>Automotive starters potting; General potting;Thermal detector
potting
>Ferrite adhesion;TIP type LED; Good adhesion to aromatic
polyester
>Relay sealant; Good adhesion to rubber, ceramics, PCB and
plastics
>Power transformers and coils; Potting capacitors; Potting of
small electricaldevices
>Adhesion to metal and plastic; LCD & substrates
adhesion;Coating andsealant; Coil ; IGBTS; Transformer; Fire
retardant
>Optical / medical component adhesive
Typical Properties of TIS-30FIP Series
|
| Property | Value | Test Method |
structure constitution
| Nickel/Graphite
| ***** |
Shielding Effectiveness 200MHz~10GHz(dB)
| ＞80 | MIL-DTL-83528C |
| Hardness ShoreA | 45 | ASTM2240 |
| Density cured(g/cm³) | 1.6 | ASTM D792 |
| Density unccured(g/cm³) | 1.8 | ASTM D792 |
Temperature Range
| -50~125℃ | ****** |
| Volume Resistivity | ≤0.04Ω.cm | ASTM D257 |
Compression Range
| 10%~60% | ASTM D575 |
20% Compression (lblin)
| 0.6 | ASTM D575 |
40% Compression (lblin)
| 1.6 | ASTM D575 |
UL Flammability Rating
| 94-V0 | UL E331100 |
Adhesion strengh (AL)
| ＞150N/m² | LT-FIP-CLE-03 |
Cure Conditions
| 15℃ to 40℃,RH50%, 24hours | ***** |
Company profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and
manufacturing superior thermal interface materials for competitive
market. Our vast experience allows us to assist our customers best
in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make
your design more perfect!
Independent R&D team
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