Thermal Shock Chambers Meets SEMI S2-0715, SEMI S8, SEMI S14 Standards

1. Product Name and Purpose

2. Product Features

• Highly Precise and Durable Chamber Construction
  • The chamber is constructed with advanced materials that can endure the intense thermal stresses. The walls are made of high-strength stainless steel, combined with specialized thermal insulation to minimize heat transfer between the hot and cold zones. The door is engineered with a precision sealing mechanism and a large viewing window, allowing operators to closely monitor the testing process without interfering with the internal environment. The interior is designed with custom racks and holders, enabling the accommodation of various semiconductor wafers, flat panel display substrates, and other components, and ensuring uniform exposure to the thermal shock conditions.
• Ultra-Precision Temperature Control and Cycling System
  • Temperature Range and Cycling: Capable of achieving a wide temperature range, typically from -80°C to +200°C. The system can execute rapid temperature cycling between the hot and cold zones, with a transition time as short as a few seconds. This is crucial for mimicking the abrupt temperature changes that semiconductor and flat panel display components may experience. The temperature control is accurate to within ±0.1°C, providing the highest level of precision required for reliable and repeatable test results.
  • Programmable Temperature Profiles: The chamber's control system allows for the creation and execution of highly complex, custom temperature profiles. Operators can define specific temperature levels, dwell times in each zone, and the sequence and number of thermal shock cycles to replicate a diverse range of real-world manufacturing and operating scenarios. This flexibility enables comprehensive testing of components under different process and usage conditions.
• Intuitive Control Panel and Advanced Data Acquisition Interface
  • The control panel is designed for ease of use by semiconductor and display engineers. It offers a user-friendly interface that allows effortless setting and adjustment of all test parameters, including temperature, cycling times, and sample identification. The panel also provides real-time displays of the current temperature in both zones, the status of the testing process, and any alarms or warnings. The chamber is integrated with a comprehensive data acquisition system that records all relevant test data. This includes detailed temperature histories, cycle counts, and any observable changes in the physical, electrical, or optical properties of the tested components. The data can be stored in a secure, encrypted format in the chamber's built-in memory or exported to external storage devices for in-depth analysis and reporting. The system can also generate detailed test reports in various industry-standard formats.
• Enhanced Safety and Protection Features
  • To ensure the safety of operators and the protection of valuable test samples and the chamber itself, a suite of advanced safety features is incorporated. These include multiple layers of over-temperature and over-current protection, emergency stop buttons with redundant circuitry, and alarms for any abnormal temperature fluctuations, equipment malfunctions, or safety hazards. The chamber is also equipped with proper ventilation and exhaust systems to handle any potentially harmful gases or vapors that may be generated during testing. Additionally, it has a built-in fire suppression system and safety interlocks to prevent unauthorized access and protect against accidents.

3. Specific Parameters

• Temperature Range and Accuracy
  • The -80°C to +200°C temperature range with ±0.1°C accuracy offers an extremely comprehensive and precise testing envelope. Semiconductor and flat panel display components have strict temperature tolerance requirements due to their complex manufacturing processes and performance expectations. For example, a semiconductor device may experience significant changes in electrical characteristics at different temperatures, and accurate temperature control is essential for evaluating its stability. The wide temperature range allows for the assessment of components under both extremely cold and hot conditions, ensuring compliance with SEMI standards.
• Thermal Shock Cycle Parameters
  • The chamber can be programmed to perform a highly customizable number of thermal shock cycles, ranging from a few dozen to several thousand, depending on the specific requirements of the component and its intended application. The dwell time in each temperature zone can be adjusted from milliseconds to hours, enabling the simulation of a vast array of manufacturing and operational scenarios. For instance, a semiconductor wafer may need to withstand short, intense thermal shock cycles during certain fabrication steps, while a flat panel display may experience longer, more gradual temperatur