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Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

    Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
     
    Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers
    • Buy cheap Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging from wholesalers

    Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

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    Brand Name : Bright Pack
    Model Number : B010
    Certification : patent for invention、BRC、GRS
    Price : ¥0.02-0.11/pcs
    Payment Terms : T/T,Western Union
    Supply Ability : 200000pcs/day
    Delivery Time : 11-13work days
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    Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

    Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging
    Product Attributes
    AttributeDescription
    Material Structure4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer). Optimized for surface resistance control.
    Surface Resistance≤10¹² Ω/sq (anti-static range), compliant with ANSI/ESD S541 and IEC 61340-5-1 standards.
    CertificationsISO 9001, ISO 14001, and RoHS/REACH compliance. Suitable for electronics in EPA (ESD Protected Areas).
    Barrier PropertiesMoisture-resistant (WVTR ≤5 g/m²*24h at 38°C/90% RH); moderate oxygen barrier (OTR ≤50 cm³/m²*day).
    Design FeaturesOctagonal bottom for stability; heat-sealable or zip-lock closure; customizable print area for branding.
    ApplicationsPCB, RAM, motherboards, IC chips, and other ESD-sensitive components.
    SustainabilityRecyclable polyethylene layers; optional biodegradable additives.
    Technical Specifications
    ParameterSpecification
    Thickness Range0.08-0.15 mm (customizable for lightweight to heavy-duty electronics).
    DimensionsWidth: 100-400 mm; Height: 150-600 mm; Bottom gusset: 50-150 mm.
    Tear Resistance≥35 N (machine direction) / ≥30 N (transverse direction).
    Seal Strength5-8 N/15mm (heat-sealable at 120-140°C).
    Static DissipationSurface resistance: 10⁶-10¹² Ω/sq; ESD shielding energy ≤30 nJ.
    Printing Options4-color flexographic printing (±0.2 mm accuracy); supports QR codes and GS1 barcodes.
    Temperature Range-40°C to 85°C (suitable for cold chain and industrial environments).
    MOQ & Lead TimeMOQ 50,000 units; production lead time: 15-25 days.
    Anti-static octagonal bottom pouch front view Close-up of pouch material layers Pouch with electronic components inside Pouch sealing mechanism detail Pouch dimensions demonstration Printed branding on pouch surface Pouch stack showing quantity Pouch with barcode label Pouch in industrial environment Pouch material cross-section Pouch with different closure types Pouch quality inspection Pouch packaging for shipping Pouch with electronic components Pouch in ESD protected area Pouch manufacturing process
    Quality Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging for sale
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