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High definition flat panel xray imaging equipment for micro component quality analysis

    Buy cheap High definition flat panel xray imaging equipment for micro component quality analysis from wholesalers
     
    Buy cheap High definition flat panel xray imaging equipment for micro component quality analysis from wholesalers
    • Buy cheap High definition flat panel xray imaging equipment for micro component quality analysis from wholesalers

    High definition flat panel xray imaging equipment for micro component quality analysis

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    Brand Name : WELLMAN
    Model Number : X-6000
    Certification : CE,FDA,ISO9001
    Payment Terms : T/T
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    High definition flat panel xray imaging equipment for micro component quality analysis

    High Definition Flat Panel X-ray Imaging Equipment for Micro Component Quality Analysis

    Advanced X-ray inspection system designed for precise quality analysis of microelectronic components and assemblies.

    Key Advantages
    • Large Detector: 130×130 mm high-definition large-area digital flat panel detector
    • Robust Table: 420×420mm table with 15KG load capacity
    • Easy Operation: Easy to use with only 2 hours training required
    • Reliable X-ray Source: Longest lifespan and maintenance-free operation
    • Automated Inspection: Programmable inspection procedures for automated inspection
    • Intuitive Navigation: Automatic navigation window - table moves to where you click
    Working Principle
    X-6000 Automatic Inspection Equipment working principle diagram showing X-ray source, sample table, and detector configuration
    Hardware Specifications
    X-ray Source
    TypeClosed, microfocus
    Max Tube Voltage90kV
    Max Tube Current200μA
    Focal Spot Size5μm
    FunctionAuto preheat
    Flat Panel Detector
    Effective Area130mm×130mm
    Pixel Size85μm
    Resolution1536×1536
    Frame Rate20fps
    Table
    Size420mm×420mm
    Detectable Area400mm×400mm
    Max Load15kg
    Equipment
    MagnificationGeometry 150X | System 1500X
    Inspection SpeedMax 3.0s/point
    Dimensions1100mm (L) × 1000mm (W) × 1600mm (H)
    Weight1000kg
    Power SupplyAC110-220V 50/60HZ
    Max Power1300W
    Industrial PCIntel I5 CPU, 8G RAM, 240GB SSD
    Displayer24" HDMI LCD
    Safety Features
    FeatureDescription
    Emergency StopLocated next to operation position for immediate power cutoff
    Tube ProtectionSoftware prevents leaving without closing X-ray tube
    Radiation LeakageNo leakage (international standard: ≤1μSv/h)
    Lead Glass Observation WindowTransparent lead glass window shields radiation to observe internal status
    Window and Back Door Safety InterlockX-ray tube powers off immediately when window or door opens
    Software Functions
    Function ModuleDescription
    OperationKeyboard and mouse can finish all operations
    X-ray tube controlUsing mouse to click the X button can turn on or off the X-ray. The real-time tube voltage and current value will display beside, users can click up and down button, or drag the slider, or type to adjust.
    Status barIndicates the interlock status, pre-heat status, and X-ray status by flashing alternately red and green.
    Image effect adjustmentThe brightness, contrast and gain of the image can be adjusted freely to achieve a satisfactory result.
    Product listUsers can save the inspection parameters such as Z-axis position, brightness, contrast and gain, and can directly call the parameters when inspecting the same product, to improve the inspection efficiency.
    Navigation windowAfter the camera takes a photo of the table, click anywhere in the photo, the table will move to the place you click and display on the screen.
    Motion axis statusDisplay real-time coordinates.
    Inspection resultThe measurement results (voids rate, distance, area, etc., set by users) display in order.
    Speed controlThe movement speed of each axis can be adjusted to slow, normal and fast.
    Voids rate measurementAutomatic calculation, parameters adjustment, add voids manually, and save parameters functionality for precise void analysis.
    Other measurement functionDistance, distance rate, angle, radius, and perimeter measurements for comprehensive component analysis.
    Automatic inspectionManual setting, array, and automatic identification modes for efficient inspection workflows.
    Application Examples
    BGA solder bridge inspection example showing X-ray image of solder connections
    BGA Solder Bridge
    BGA solder voids inspection example showing internal void detection
    BGA Solder Voids
    PCB through-hole inspection example showing plated through-hole quality
    PCB Through-Hole
    IC voids and gold wire inspection example showing internal wire bonds
    IC Voids and Gold Wire
    LED solder voids inspection example showing LED component soldering
    LED Solder Voids
    LED gold wire crack inspection example showing wire bond integrity
    LED Gold Wire Crack
    Capacitor inspection example showing internal capacitor structure
    Capacitor
    Inductor inspection example showing coil winding integrity
    Inductor
    Sensor inspection example showing sensor internal components
    Sensor
    Thyristor surge suppressors inspection example showing semiconductor structure
    Thyristor Surge Suppressors
    Fiberglass inspection example showing composite material structure
    Fiberglass
    Cable inspection example showing internal wire connections
    Cable
    Diode inspection example showing semiconductor junction
    Diode
    Steel pipe welding gap inspection example showing weld integrity
    Steel Pipe Welding Gap
    Automobile electronics inspection example showing automotive component analysis
    Automobile Electronics
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