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Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

    Buy cheap Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT from wholesalers
     
    Buy cheap Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT from wholesalers
    • Buy cheap Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT from wholesalers
    • Buy cheap Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT from wholesalers
    • Buy cheap Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT from wholesalers

    Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

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    Brand Name : Bai Zhuang
    Model Number : BZ-6807(WT)
    Certification : UL File: E352175
    Price : Negotiable
    Payment Terms : T/T,L/C,D/A,D/P
    Supply Ability : 1000 Tons per Month
    Delivery Time : 7 working days after payment
    • Product Details
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    Encapsulated Polyurethane Potting Compounds Material For Pcb Electronic Components 6807 WT

    Heat-Resistant Polyurethane Potting Compound with Excellent Electrical Properties

    Product Description


    BZ-6807(WT) is a white, heat-resistant polyurethane potting material featuring V0-grade flame retardancy and RTI 130°C thermal endurance. It delivers strong electrical and mechanical performance, making it ideal for potting power modules, control boards, sensors, and general power electronic devices.

    Key Product Features

    1. Two-part black system, easy to dispense manually or with automated equipment;
    2. Excellent flow and permeability for smooth, bubble-free filling;
    3. RoHS and REACH compliant, supporting hassle-free global logistics;
    4. UL94 V-0 flame rating and RTI-130°C heat resistance (UL Yellow Card: QMFZ2.E352175);
    5. Strong adhesion to substrates, with proven durability under thermal cycling and humid conditions;
    6. Reliable electrical insulation and consistent mechanical robustness.​


    Technical Parameters

    Parameters

    Hardener

    BZ-6807WT A

    Resin

    BZ-6807WT B

    Before curing

    Appearance

    Brown liquid

    White liquid

    Viscosity(cps.25℃)

    100-250

    3000-5500

    Initial mixed viscosity(cps.25℃)

    1300±300

    Density(g/cm³.25℃)

    1.21±0.05

    1.53±0.05

    Mixing

    &

    Curing

    Mix ratio(by weight)

    A:B=1:5

    Pot life 130±30g(min.25℃)

    35±10

    Curing condition

    Room temperature curing

    Surface drying time 30g(H.25℃)

    3.5-5.5 H

    Curing time 30g(H.25℃)

    5-10 H

    Curing time(Heated)

    60℃ heated 1H

    After curing

    Color

    White

    Hardness (Shore D)

    50±10

    Temperature resistance(℃)

    -40~130

    Flame retardancy UL94

    (Vertical burning)

    V0

    Thermal conductivity(W/m.k)

    ≥0.50

    Water absorption(24H)

    0.1%

    Surface resistivity(Ω/sq)

    ≥1.0×1013

    Volume resistivity(Ω.cm)

    ≥1.0×1013

    Tensile strength(MPa)

    ≥3

    Dielectric constant(at 50Hz)

    ≥6

    Breakdown voltage(kV/mm)

    20

    Average Linear Coefficient of Thermal Expansion

    149×10-6K-1

    Comparative Tracking Index (CTI)

    Ⅰ/600V



    Product Applications


    1. Automotive Electronics: Excellent Electrical Performance, Vibration Resistance, Flame Retardant V0 Class, Heat Stability and Reliability
    2. Low-altitude aircraft: Low density can be combined with lightweight design, flexible materials, and waterproof IP68
    3. Sensor: low density, flame-retardant V0, low dielectric constant, and low-temperature resistant;
    4. Industrial controllers and control boards: Excellent high-temperature resistance, compliant with RTI 130 temperature rating standards, featuring high thermal conductivity and heat dissipation capabilities, with V0-class fire resistance.
    5. Other electronic products: Flame-retardant V0, UL Yellow Card, compliant with RTI 130 temperature resistance standard. Their outstanding electrical and mechanical properties meet most electronic products' requirements for high-performance materials.



    Directions for Use

    1. Pre-potting Preparation: Calibrate scales, prepare potting tools, cleaning tools, check machine settings, check vacuum pump force, etc.
    2. Product Pre-treatment: Place product on a level surface or fixture. Remove dust, clean, degrease, and dry if necessary.
    3. Accurate Proportioning: Manual operation requires precise mixing according to the specified ratio and recording. Machine potting requires calibrated ratios and first-article confirmation is recommended.
    4. Mixing & Stirring: Manual operation requires thorough stirring or using electric stirrers to ensure homogeneous mixing. Machine potting requires sufficient stirring speed, adjust as needed.
    5. Uniform Potting: Manual operation should be done in small, multiple batches to ensure uniformity. Machine potting should follow the programmed path for quantitative dispensing.
    6. Inspection or Secondary Potting: After potting, visually inspect as needed. Perform touch-up, bubble removal, or secondary potting if required.
    7. Curing: Allow the potted and inspected products to cure at room temperature or with heat assistance (recommended 60°C if needed), according to product and process requirements.
    8. Final Product Confirmation: Perform visual inspection and performance testing as required by the customer.


    Packing

    1. Hardener: Typically 5KG/10KG/25KG/200KG metal or plastic drums.
    2. Resin: Typically 25KG/200KG metal or plastic drums.
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