We are excited to introduce our latest PCB product made with Rogers RO4003C material and a lead-free process. This PCB offers reliable operation in a
temperature range of -40℃ to +85℃, making it ideal for various
applications.
The PCB stack-up includes base copper of 17um, RO4003C dielectric
of 20mil, RO4450F prepreg, base copper of 17um, RO4003C dielectric
of 60mil, RO4450F prepreg, RO4003C dielectric of 60mil, RO4450F
prepreg, RO4003C dielectric of 20mil, and base copper of 17um. The
board dimensions are 90 x 90 mm, with a minimum Trace/Space of 5/5
mils and a minimum Hole Size of 16 mils. The finished board
thickness is 4.8 mm, with a finished Cu weight of 1 oz (1.4 mils)
all layers and via plating thickness of 1 mil. The surface finish
is Immersion Nickle Immersion Palladium and Immersion Gold
(ENEPIG), and the top and bottom silkscreen are not included. The
top and bottom solder mask is Matt Black, and there is no
silkscreen on the solder pads. The PCB has passed a 100% electrical
test.
The minimum via needs to be filled with copper paste for better
thermal dissipation, and countersunk holes are required to avoid
screw protrusion and ensure a flat installation surface. Solder
paste stencils are supplied for the top side.
The PCB includes 31 components, with a total of 92 pads, 51
through-hole pads, 15 top SMT pads, 26 bottom SMT pads, 59 vias,
and 75 nets.
If you have any technical questions, please feel free to contact
Ivy at [email protected].
Choose RO4003C for superior high integrity and high-frequency
applications
In the world of printed circuit boards (PCBs), signal integrity and
performance are crucial. The choice of material is essential for
any high-frequency application. RO4003C is the ultimate PCB
material for such applications. Its exceptional properties and
performance characteristics make it the go-to choice for designers
looking to optimize their circuits.
Properties and Performance Characteristics of RO4003C
RO4003C is a high-performance PCB material made with ceramic-filled
hydrocarbon. This combination provides excellent electrical
properties, including a dielectric constant of 3.38±0.05 at 10 GHz
and a dissipation factor of 0.0027 at 10 GHz/23℃. These properties
ensure optimal signal integrity, making it ideal for high-speed
digital and RF circuits.
RO4003C also has a high thermal conductivity of 0.71 W/M/oK at 80℃,
which makes it an excellent choice for applications that require
efficient heat dissipation. It has a low coefficient of thermal
expansion (CTE) of 11 ppm/℃ in the X direction, 14 ppm/℃ in the Y
direction, and 46 ppm/℃ in the Z direction, which ensures
dimensional stability in extreme temperature environments.
Advantages of RO4003C Over Other PCB Materials
Compared to other PCB materials, RO4003C offers several advantages.
It has a lead-free process compatibility, making it an
environmentally friendly option. It has a higher thermal
conductivity than FR-4, which means it can handle higher power
levels without overheating. It also has a lower dielectric loss
than other high-frequency materials like PTFE, which translates to
better signal integrity and reduced signal loss.
RO4003C PCB Design Considerations for Optimal Performance
Designing with RO4003C requires specific considerations. For
example, the thickness of the dielectric layers affects the
characteristic impedance, which must be carefully controlled for
proper signal propagation. The substrate's surface finish is also
critical to ensure reliable soldering and interconnectivity.
Applications of RO4003C PCBs in Various Industries
RO4003C is widely used in various industries, including
telecommunications, aerospace and defense, medical, and automotive.
Its exceptional performance characteristics make it an ideal choice
for high-frequency applications in these industries. For example,
it is frequently used in 5G and IoT applications, where signal
integrity is critical for reliable communication. It is also used
in aerospace and defense applications, where the circuits must
withstand extreme temperature and humidity conditions.
RO4003C and the Future of High-Speed Digital Design
As digital design evolves, the demand for materials that can handle
higher speeds and frequencies will only increase. RO4003C is
well-positioned to meet these demands, thanks to its exceptional
performance characteristics. Its low dielectric loss and high
thermal conductivity make it an ideal choice for high-speed digital
design applications, such as data centers and high-performance
computing.
RO4003C PCB Fabrication and Assembly
RO4003C PCBs require specialized fabrication and assembly processes
to ensure optimal performance. For example, the minimum via size
must be carefully controlled to prevent signal loss, and
countersunk holes are required to ensure a flat installation
surface. Solder paste stencils are also supplied for the top side
to ensure reliable soldering.
Troubleshooting Common Issues with RO4003C PCBs
Despite its exceptional performance characteristics, designers may
encounter issues when working with RO4003C PCBs. For example,
issues with soldering and interconnectivity can arise if the
substrate's surface finish is not properly controlled.
Understanding these issues and how to troubleshoot them is critical
for ensuring optimal performance.
RO4003C and Lead-Free Process Compatibility
RO4003C is compatible with lead-free processes, making it an
environmentally friendly option for designers. This compatibility
ensures that designers can meet environmental regulations without
sacrificing performance.
RO4003C vs. Other High-Frequency PCB Materials: A Comparative
Analysis
While RO4003C offers exceptional performance characteristics,
designers may wonder how it compares to other high-frequency PCB
materials. A comparative analysis can help designers understand how
RO4003C stacks up against other options and make an informed
decision when selecting a PCB material.
Conclusion
RO4003C is the ultimate PCB material for high-frequency
applications. Its exceptional properties and performance
characteristics make it an ideal choice for designers looking to
optimize their circuits. From 5G and IoT applications to aerospace
and defense, RO4003C is well-positioned to meet the demands of
various industries. By understanding its properties, design
considerations, and troubleshooting common issues, designers can
unlock the full potential of RO4003C for their applications.
