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Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry

    Buy cheap Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry from wholesalers
     
    Buy cheap Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry from wholesalers
    • Buy cheap Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry from wholesalers
    • Buy cheap Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry from wholesalers
    • Buy cheap Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry from wholesalers

    Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry

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    Brand Name : Mingseal
    Model Number : FS700F
    Certification : ISO CE
    Price : $28000-$150000 / pcs
    Payment Terms : L/C,D/A,D/P,T/T,Western Union
    Delivery Time : 5-60 Days
    • Product Details
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    Large Format Adhesive Dispensing Machine — Inline Visual Dispensing System for SMT Industry

    Product overview

    This large format adhesive dispensing machine is designed for SMT production lines handling large boards and display modules. The platform integrates a heavy‑duty gantry, multi‑nozzle dispense heads, integrated 2D/3D vision alignment, or quick disassembly options, AOI for inline verification, and MES interfaces. It supports synchronized/asynchronized valve dispense modes for high UPH.


    Problem → Cause → Solution

    Problem: Large panels commonly show inconsistent dispensing and placement drift across board width, causing functional defects.
    Cause: Insufficient motion stability, poor registration on large surfaces, adhesive temperature/viscosity variation and low single‑head throughput lead to variability.
    Solution: A large format gantry with multi‑nozzle banks, vision‑guided fly-alignment and temperature‑controlled dispensing stabilizes deposit volume and position; validated recipes and AOI ensure repeatable production.


    Technical Specifications

    Structure

    Floor-mounted gantry (marble frame + mobile gantry )

    Dimensions (W × D × H)

    1360 × 1280 × 1550 mm

    Dispensing range ( W × D)

    ( Single valve vertical dispensing)

    900 × 600 mm

    Max. speed

    X/ Y:1300 mm/ s Z: 500 mm/ s

    Max. acceleration

    X/ Y:1.3 g Z: 0.5 g

    Repeatability (3 sigma)

    X/ Y: ± 0.015 mm Z: ± 0.005 mm

    Positioning accuracy (3 sigma)

    X/ Y: ± 0.03 mm Z: ± 0.01 mm

    Track width adjustment method

    Automatic width adjustment

    Track width adjustment range

    150 ~ 500 mm

    Conveyor belt load

    5kg

    Max. substrate thickness

    0.5 ~ 10 mm

    Max. height of devices on top of PCB

    25 mm

    Max. height of devices on bottom of PCB

    25 mm

    Conveyor track

    Stainless steel chains

    Camera pixels (optional)

    130 W black & white (Optional)

    Light source

    RGB colored light source (Optional)

    Input voltage

    220 VAC 50 ± Hz

    Power

    3.5 KW



    Applications

    • Large SMT panel underfill, bead sealing and component fixation for displays and lighting modules.
    • Gasket/perimeter sealing and thermal pad placement on large boards.
    • High UPH production with parallel dispensing across wide panels.


    How to choose

    • Panel footprint: choose working width matching your maximum panel dimensions and fixture layout.
    • Throughput vs precision: use multi‑nozzle banks and parallel dispense for UPH; choose piezo/VCM valves and vision alignment for micro‑dots.
    • Adhesive compatibility: for filled/high‑viscosity adhesives prefer piston/peristaltic pumps and heated feed lines; for low‑viscosity fluids pressure/time or micro‑valve may suffice.
    • Integration & traceability: enable MES/OPC‑UA when recipe push/pull and SPC logging are required.


    FAQ

    Q: What is the minimum deposit size achievable?
    A: Typical minimum volume ≥0.01 μL depending on nozzle and adhesive viscosity—confirm with sample validation.
    Q: Can the system handle filled adhesives?
    A: Yes—use piston/peristaltic pump options with heated feed lines for filled or thixotropic adhesives; validate in pilot tests.
    Q: Does the machine support MES recipe management?
    A: Yes—supports recipe push/pull and batch logging via standard industrial protocols (EtherNet/IP / OPC‑UA / RS‑485).




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