Automatic Hot Bar Soldering Machine Soldering Flex to Rigid PCB
Hot Bar Soldering Machine Introduction:
Our hot bar bonding and soldering machines, easy to use, robust and
economical for bonding flex to rigid assemnlies such as flex to
PCB, LCD-Flex to PCB, Flex to LCD, HSC to LCD, HSC to PCB, Wires to
PCB.
Hot Bar Soldering Machine Features:
Unique pulse heat technology provides fastest soldering head
heating.
Programmable soldering temperature, heat-up rate and time duration
for a wide range of products.
Thermocouple is fixed in close proximity to the working surface &
the thermode, thus providing accurate temperature feedback control.
Closed Loop PID temperature control with clearly visible LED
display.
Soldering time can be programmable and is triggered by temperature.
Floating thermode ensures consistent pressure and heat transfer
between the thermode head and the parts to be joined.
Programmable pressure switch with LCD display for precise force
control.
CCD camera system with magnification lens can be retrofitted for
fine-pitch positioning.
Hot Bar Soldering Machine Specification:
| Machine size | 610×410×450mm |
| Working area | Max 150*150mm |
| Machine weight | 62Kg |
| Working air pressure | 0.6-0.8Mpa |
| Fixture quantity | 2 |
| Thermode head size | Max 40*3mm |
| Welding precision | pitch 0.2mm |
| Pressing time | 1~99.9s |
| Temperature settings | RT~500℃ tolerance ±5℃ |
| Welding pressure | 1~20Kg |
| Temperature settings | Two |
| Working environment | 10-60℃,40%-95% |
| Power supply | AC220V±10% 50HZ,2200W |
| Alignment mode | CCD + LCD Monitor |
| Feeding mode | Manual |
| Starting mode | Press start button |
| Rotation Platform | Cylinder control,tolerance<0.02mm |
Hot Bar Soldering Machine Applications:
Heat Sealing Paratmeter:
1. Temperature range: 50℃ to 400℃
2. Temperature accuracy: ±1°C
3. Bond timer: 0-12 seconds
4. Bond air pressure: 0.4-0.6MPa
5. Pressure accuracy: ±0.05MPa
6. Max bond force: 1100N
Hot Bar Soldering Machine Details:
