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PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

    Buy cheap PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout from wholesalers
     
    Buy cheap PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout from wholesalers
    • Buy cheap PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout from wholesalers
    • Buy cheap PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout from wholesalers

    PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

    Ask Lasest Price
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 100000pc/Month
    Delivery Time : 4 Weeks
    Brand Name : CUSTOM MADE
    Certification : ISO/UL
    • Product Details
    • Company Profile

    PTFE PCB Layout Design Mixed Voltage Printed Circuit Board Layout

    PTFE PCB Layout Design Mixed Voltage Embedded Capacitor Carbon Ink


    PCB Layout Design Description:

    1. Focus on component sourcing.
    2. Management team with 10+ years of experience in the material.
    3. PCB Component Sourcing Teams: Project department, Engineering department, Purchasing.
    4. department, Quality department, Customs Declaration department.
    5. Professional component validation engineers.
    6. Professional BOM Engineers.


    PCB Layout Design Parameters:

    ItemTechnical Parameter
    Layer2-64
    Thickness0.5-17.5mm
    Copper Thickness0.3-12 oz
    Min Mechanical Hole0.1mm
    Min Laser Hole0.075mm
    HDI1+n+1,2+n+2,3+n+3
    Max Aspect Ratio20:01
    Max Board Size650mm*1130mm
    Min Width/Space2.4/2.4mil
    Min Outline Tolerance±0.1mm
    Impedance Tolerance±5%
    Min PP Thickness0.06mm
    Bow &Twist≤0.5%
    MaterialsFR4,High-Tg FR4,Rogers, Nelco,RCC,PTFE, M4, M6,TU862,TU872
    Surface FinishedHASL, HASL Pb Free Immersion Gold/Tin/Silver Osp, Immersion Gold+OSP
    Special CapabilityGold Finger Plating, Peelable, Carbon ink


    PCB Layout Design Introduction:

    1. Under normal circumstances, all components should be arranged on the same side of the circuit board. Only when the top components are too dense, can some devices with limited height and low heat generation, such as chip resistors, chip capacitors, Chip IC, etc. are placed on the bottom layer.

    2. On the premise of ensuring electrical performance, components should be placed on the grid and arranged in parallel or perpendicular to each other to be neat and beautiful. In general, components are not allowed to overlap; the arrangement of components should be compact, and components should be placed on the entire layout. The distribution is uniform and the density is consistent.

    3. The minimum spacing between adjacent pad patterns of different components on the circuit board should be more than 1MM.

    4. The distance from the edge of the circuit board is generally not less than 2MM. The best shape of the circuit board is a rectangle, and the aspect ratio is 3:2 or 4:3. When the surface size of the circuit board is greater than 200MM by 150MM, it should be considered that the circuit board can withstand Mechanical strength.

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