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High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

    Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers
     
    Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers
    • Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers
    • Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers
    • Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers
    • Buy cheap High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer from wholesalers

    High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

    Ask Lasest Price
    Brand Name : TOPCBS
    Model Number : BIB and test Boards
    Certification : UL94V0
    Price : Negotiation
    Payment Terms : T/T
    Supply Ability : 10000unit per month
    Delivery Time : 10-14working days
    • Product Details
    • Company Profile

    High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

    0.25 pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards / thin board


    • Reduced product development time
    • Increased customer confidence
    • 100% product quality and reliability
    • A forecast life expectancy
    • Reduced circuit board manufacturing costs
    • Increased profitability
    • Reduced after sales service

    1 . Descriptions:


    What is a BIB ?


    A burn-in board is a printed circuit board that is used in the burn-in process. The components added to the board are stressed using extreme heat to highlight any failures. Once the stress tests have been completed engineers will analyse the results to make sure everything is working within the correct parameters.


    2 . Specifications:


    Name0.25pitch 12Layer HDI PCBs for Burn in boards and semiconductor Test boards
    Number of Layers12
    Quality GradeIPC 6012 Class 2,IPC 6012 Class 3
    MaterialIT180
    Thickness0.7mm
    Min Track/Spacing75um/75um
    Min Hole SizeLaser 75um
    Solder MaskGreen
    SilkscreenWhite
    Surface FinishImmersion gold + OSP
    Finished Copper12um
    Production time10-21 working days
    Lead time2-3 days

    Product Tags:

    pcb burn in test 0.25 pitch

      

    hdi pcb burn-in test procedure 0.25 pitch

      

    hdi pcb burn-in test procedure 12Layer

      
    Quality High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer for sale

    High Density Interconnect Hdi Pcb Burn In Test Procedure 0.25 Pitch 12Layer

    Company Info.
    Topmatch Electronics (Suzhou) Co., Limited.
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