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High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

Name: High Sensitivity 1024768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module
Brand: SensorMicro
Price: 1 USD

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Brand Name :	SensorMicro
Model Number :	GAVIN GC1010HMG
Certification :	ISO9001:2015; RoHS; Reach
Price :	Negotiable
Payment Terms :	T/T

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High Sensitivity 1024×768 Resolution 10μm Pixel Pitch Thermal Camera Core Cooled Camera Module

High Sensitivity Thermal Camera Core Cooled Camera Module 1024×768 / 10μm

Product Overview

The GAVIN GC1010HMG infrared camera core integrates a 1024×768/10μm HOT MWIR cooled infrared detector, offering a larger array and smaller pixels compared to the GAVIN GC615HMG, resulting in clearer imaging with finer details. Combined with next-generation image processing algorithms, it delivers stable, high-quality images, while HOT technology enables next-level SWaP optimizations with smaller and lighter design, and low power consumption.

As a leading thermal imaging module manufacturer, we provide customers with a wide variety of mature integration solutions. By using infrared camera modules, it is convenient for them to conduct secondary development and reduce their time of independent research and development.

Main Features

Superior Quality with Larger FPA and Smaller Pixel Size
- Developed based on a 1024×768/10μm large-format HOT MWIR cooled infrared detector, delivering clear images and wide field of view
- Equipped with next-generation image processing algorithms including DRC, 2D/3D noise reduction, and EE edge enhancement for superior image quality
- Smaller 10μm pixel size provides higher spatial resolution and better signal-to-noise ratio
SWaP Optimization Leading by HOT Technology
- Supports 150K high-temperature operation, with cooling time ≤ 4min
- Compact size: 87×94×54.5mm, lightweight: 460g
Rich Interfaces, Easy Integration
- Supports CameraLink/USB3.0/GigE/HDMI/SDI/MIPI/Fiber optic interfaces
- Flexible RAW/YUV image output

Product Specifications

Model	GAVIN GC1010HMG HOT MWIR Cooled Infrared Camera Core
Resolution	1024×768
Pixel Size	10μm
Spectral Response	3.7μm±0.2μm～4.8μm±0.2μm
IR Detector NETD(23℃)	20mK(F2) 25mK(F4)
Frame Rate	50Hz
Digital Zoom	1× to 8× continuous digital zoom
Image Direction	Horizontally/Vertically/Diagonally Flip
Image Algorithm	DRC, 2D/3D Image Noise Reduction, EE
Analog Video	PAL/NTSC
Digital Video	Standard: DVP/LVDS/USB2.0 Option: Cameralink/USB3.0/GigE/SDI/HDMI/MIPI/Single-mode Optical Fiber/Multi-mode Optical Fiber
External Sync	Standard: LV-TTL Option: RS422/LVDS
Communication	Standard: USB2.0/LV-TTL Option: RS422/CAN/USB3.0/GigE
Power Supply	12V±1V
Steady Power Consumption(23℃)	≤8W
Cooling Time(23℃)	≤4min
Size(mm)	87×94×54.5
Weight(g)	≤460
Operating Temperature	-40℃~+71℃
Lens Options	Fixed focus: 25mm/F2

Industrial Applications

The GAVIN GC1010HMG thermal infrared camera module is widely used in many areas such as NDT, Environmental Monitoring, Long-Range Surveillance, Scientific Research etc.

Our Advantages

High sensitivity and excellent performance
World-leading technology in infrared industry
Various infrared detectors available
Both uncooled and cooled IR detectors in different formats and pixel size
Volume production to ensure fast delivery
Three production lines with annual production capability up to millions of detectors

Frequently Asked Questions

1. What is infrared detector / thermal imaging sensor?

Infrared waves cannot be seen with the human eye. Infrared detector / thermal imaging sensor is an optical-electrical device to react to infrared radiation and thermal energy and convert it into electrical signal and then output visible thermal images.

2. What is WLP?

WLP refers to wafer level package. It is the process of completing high vacuum packaging directly on the entire MEMS wafer, then scribing and cutting to make a single infrared sensor. Together with metal package, ceramic package, they are the 3 main package formats of uncooled infrared detectors.

3. What's the advantage of WLP?

WLP IR detectors are specially designed to meet the miniaturization and low cost requirement in the application of infrared technology to consumer electronics market. We are now offering a variety of WLP infrared module solutions to boost more new applications of emerging markets.

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