Steel IC Lead Frame Stamping Mold

FAQ:

• Q: What is the brand name of this product?
  A: The brand name of this product is TJIN.
• Q: What is the model number of this product?
  A: The model number of this product is 006.
• Q: Where is this product manufactured?
  A: This product is manufactured in China.
• Q: Is this product certified?
  A: Yes, this product is certified with ISO9001.
• Q: What is the minimum order quantity for this product?
  A: The minimum order quantity for this product is 1.
• Q: How is this product packaged?
  A: This product is packaged in wooden packaging.
• Q: What is the delivery time for this product?
  A: The delivery time for this product is 40 days.
• Q: What are the payment terms for this product?
  A: The payment terms for this product is TT (telegraphic transfer).

You can customize various lead framework molds as needed to ensure quality!
Suitable for various chips, ICs, semiconductor devices, etc.;
Using imported raw materials, the accuracy is as high as ± 0.001mm, the performance is stable, and the service life is high;
Customized as needed, advanced technology, responsible for installing, debugging and training, no worry -free after -sales!

Customization:

Brand Name: TJIN

Model Number: 006

Place of Origin: China

Certification: ISO9001

Minimum Order Quantity: 1

Packaging Details: Wooden Packaging

Delivery Time: 40 days

Payment Terms: TT

Mold Life: 100,000 Shots

Mold Type: Stamping Mold

Runner System: Hot Runner/Cold Runner

Mold Base: LKM, DME, HASCO, Etc.

Hardness: HRC 50-60

At TJIN, we specialize in providing high-quality lead frame stamping molds for our customers. Our IC Lead Frame Stamping Mold (Model Number: 006) is designed and manufactured in China, and certified with ISO9001 for its quality and reliability.

Our professional team of experts will work closely with you to customize the mold according to your specific requirements. We have a minimum order quantity of 1, and our packaging is done in wooden crates to ensure safe delivery.

With a mold life of 100,000 shots and a hardness of HRC 50-60, our stamping mold is built to last and withstand high production volumes. You can choose between a hot runner or cold runner system, and the mold base options include LKM, DME, HASCO, and more.

Trust TJIN for all your IC lead frame stamping mold needs. Contact us today for more information and to place your order.

Packing and Shipping:

Product Name: IC Lead Frame Stamping Mold

The IC Lead Frame Stamping Mold will be carefully packaged and shipped to ensure its safe arrival to your desired location. Here is the packaging and shipping information:

• The mold will be first wrapped in protective bubble wrap.
• It will then be placed in a sturdy cardboard box with additional padding to prevent any damage during transit.
• The box will be sealed with tape and labeled with the product name and shipping information.

• We offer both domestic and international shipping options.
• For domestic shipping, we use reliable courier services such as UPS, FedEx, or USPS.
• For international shipping, we use trusted carriers to ensure timely and safe delivery.
• The shipping cost will be calculated based on the destination and weight of the package.

Once the package is shipped, you will receive a confirmation email with the tracking information. Please note that the estimated delivery time may vary depending on the shipping method and destination.

Thank you for choosing our IC Lead Frame Stamping Mold. We are confident that it will meet your expectations and help you with your production needs. If you have any further questions or concerns, please do not hesitate to contact us.

Technical Parameters:

Product Description:

The IC Lead Frame Stamping Mold is a highly efficient and precise tool used in the production of integrated circuits (IC). It is designed to create high-quality lead frames that are essential in the packaging and assembly of IC chips. This mold type is specifically designed for the stamping process, which is a common method used in the production of lead frames.

The IC Lead Frame Stamping Mold is a specialized type of mold that is used in the stamping process. This process involves using a die to cut and shape metal sheets into the desired lead frame shape. The stamping process is highly efficient and cost-effective, making it a popular choice in the production of lead frames.

The IC Lead Frame Stamping Mold is equipped with a water cooling system to ensure the efficient and precise production of lead frames. This system helps to dissipate the heat generated during the stamping process, which is essential in maintaining the accuracy and quality of the lead frames.

The IC Lead Frame Stamping Mold is designed with a single cavity, which means that it can produce one lead frame at a time. This feature allows for better control and accuracy in the stamping process, resulting in high-quality lead frames.

The IC Lead Frame Stamping Mold is available in customized sizes to meet the specific requirements of different IC production processes. This allows for flexibility and adaptability in the production of lead frames, ensuring that they are tailored to fit the unique needs of each project.

The IC Lead Frame Stamping Mold has a short lead time of 4-6 weeks, making it an ideal choice for time-sensitive projects. This fast production time is made possible by the use of high-quality materials and advanced manufacturing techniques, ensuring that the mold is delivered in a timely manner.

In conclusion, the High-Life IC Lead Frame Mold is a high-precision tool that is essential in the production of integrated circuits. With its specialized stamping process, water cooling system, single cavity design, customized size, and short lead time, it is the ideal choice for producing high-quality lead frames efficiently and cost-effectively.

Our company is a leading enterprise in China that has long been committed to the R & D, production, manufacturing and sales of the semiconductor's leading frame mold and (integrated circuit IC) the post-process packaging equipment . 

As a professional semiconductor semiconductor package equipment is used in precision processing made by semiconductor equipment corporation，it need semiconductor tooling，spares part，and as well as plastic molding kit. We have advanced production equipment and technical teams that can service according to customer needs.

In terms of foreign trade development, we have rich experience and wide customer network. In the 13 years since the establishment of the company, our products have been successfully exported to more than 50 countries and regions such as Russia, France, Germany, Japan, the United States, Brazil, India, Thailand, Hong Kong, Malaysia, and Saudi Arabia and have received the unanimous praise from global customers.

We make a series of molds required to include the Auto Molding system , Trim & Form singulation System ,Lead frame stamp tools,MGP mold and other semiconductor's post—processes. Whether it is semiconductor separate devices, capacitors, inductors, resistors, bridge circuits, vehicle electrons, etc., or the LED industry, the LED industry's MicroLED & mini-led solid packaging. We not only provide a plan for your newly developed products, but also provide suggestions from the aspects of improving product quality and improving costs for the products that exist in production.

If you are interested it, we can talk in detail and look forward to cooperating with you.