0.25MM Resin Bond Diamond Blades Dicing For Wafer Semicoductor Ceramic Chips

Resin bond daimond dicing Blade for wafer semicoductor,ceramic chips

Hongtuo’s HT-RB series resin bond diamond blades are some of the most advanced in diamond grinding technology. They apply a thermosetting resin bond material and inter it with diamond abrasives. This diamond grinding tool features an outstanding flexibility and can greatly improve cutting efficiency.It has become a preferred super abrasive tool for cutting hard, brittle and delicate materials, such as glass and crystalline materials.

Features:

1. Theresin bond diamond dicing blade comes with a great self-sharpening performance, which ensures a consistent sharpness and a high cutting efficiency.

2. Resin bonds are extremely flexible, therefore improving the surface finish quality.

Applications:

This dicing blade is best suited for cutting hard and brittle materials such as quartz and glass.

Specifications

Technical Parameters

Zhengzhou Hongtuo Superabrasive Tools Co.,Ltd was founded in 1997.It is a high-tech company engaged in R&D,production,sale and service of superabrasive tools.The company has 350 employees,over 300 sets of manufacturing and testing equipments.With 2 advanced metal bonded honing stones and vitrified bonded diamond&CBN grinding wheels production lines,which can produce750 000 pieces honing stones and 4 000 pieces grinding wheels annually.The company has been granted the ISO9001:2000 certificate in 2000.In the same year,it has been obtained the certificate of “high-new technology company”and “high-new technology products”granted by Science&Technology Division of Henan province.

Our products are widely used in the such industries as:automobile parts,motor parts,refrigeration compressor,aviation,hydraulics,sewing-machine parts and bearings.In respect of product quality,development and production capacity,the company is a leading manufacturer in the industry.it can meet all kinds of requirement.At present,a great parts of our proucts are sold to countries and regions as Europe,Japan,Taiwan and South-East Asian countries.

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