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Company News
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111 Articles
负责任采购与冲突矿产政策
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2024-10-30
HOREXS helps promote the upgrading of glass substrate industry
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2024-08-24
uHDI PCB knowledge and development
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2024-08-24
uHDI PCB capability in HOREXS
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2024-07-01
HOREXS will attend the Semicon Eurpa 2024
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2023-07-03
FCBGA (ABF) Substrate
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2023-05-11
HOREXS attend Malaysia EMAX-Electronics Manufacturing exhibition
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2023-02-06
CNY holiday end,2nd factory running
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2022-10-31
Visit & explore HOREXS IC substrate manufacturing plant
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2022-10-13
HOREXS new plant (package substrate) factory was put into production
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2022-10-13
HOREXS facility
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2022-07-25
IC Substrate Technology Overview
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2022-07-11
HOREXS support SIP(System in package) substrate manufacture
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2022-07-11
HOREXS support FBGA package substrate production
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2022-07-04
Packaging substrates are in the golden track, and multiple factors accelerate domestic expansion
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2022-07-01
ABF material substrate in short supply
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2022-06-30
The NAND memory industry landscape is undergoing a major reorganization
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2022-06-30
Evolution of CMOS Image Sensor Architectures
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2022-06-30
TSMC advanced packaging, the latest progress
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2022-06-30
U.S. sanctions, Russian semiconductors plummet by 90%
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2022-06-29
HOREXS supporting Substrate types
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2022-06-13
Speed up IC Substrate manufacture,HOREXS 2nd plant running in July
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2021-04-28
How will DRAM shrink?
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2021-04-28