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111 Articles
2021-04-28
The UK should also vigorously develop local semiconductors?
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2021-04-28
Production capacity for packaging and testing is tight, OSAT sweeps machines to prepare for battle
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2021-04-28
Why is the semiconductor packaging and testing industry transitioning from IDM to OSAT?
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2021-04-28
The price increase has spread to packaging and testing plants, and the overall price increase will be 20%-30%
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2021-04-26
HOREXS invested 2 billion on second IC substrate factory,Building now
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2021-03-29
Advanced packaging IC semiconductor
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2021-03-29
MiniLed/Micro LED will booming very soon
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2021-03-11
More Data, More Memory-Scaling Problems
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2021-03-11
DRAM, 3D NAND Face New Challenges
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2021-03-11
Process Window Optimization Of DRAM By Virtual Fabrication
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2021-03-11
DRAM’s Persistent Threat To Chip Security
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2021-03-11
Manufacturing Bits: DRAM Substrate(HOREXS brand )
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2021-03-11
Domain-Specific Memory
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2021-03-11
The Race To Much More Advanced Packaging
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2021-03-11
Momentum Builds For Advanced Packaging
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2021-03-11
Emerging Apps And Challenges For Packaging
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2021-03-11
Packaging Demands For RF And Microwave Devices
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2021-03-11
Shortages, Challenges Engulf Packaging Supply Chain
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2021-03-11
Stronger, Better Bonding In Advanced Packaging
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2021-03-11
HOREXS also as one of the roles to paves Brazil New Semiconductor Path
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2021-03-11
Micro LED booming is coming
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2021-03-11
Similarities and differences between SiP and advanced packaging
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2021-03-11
DRAM contract prices rose across the board
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2021-03-11