HongRuiXing (Hubei) Electronics Co.,Ltd. News - Company News & Industry Updates

2021-03-11

SMIC obtains permission from the United States to resume supply of 14nm chips; TSMC will begin 3nm chips ； HOREXS enlarge IC substrate capacity

2021-03-11

Flip Chip Packaging substrate HOREXS

2021-03-11

Sip package substrate

2021-03-11

Packaging Substrate manufacture HOREXS

2021-03-11

DRAM substrate market is booming now

2021-01-25

The Mini-LED market is ready to take off, and the total investment in industrial chain projects exceeds 85 billion yuan

2021-01-23

Samsung develops 12-layer TSV package

2021-01-23

Sigfox system-in-package

2021-01-23

Why System in Package Technology Must Replace System on a Chip Technology

2021-01-23

SOC vs. SIP

2021-01-23

System-on-chip (SoC) complex design choices: RISC-V and SoC design platform

2021-01-23

Six Chinese influence the development of semiconductors

2021-01-23

7 factors affecting the semiconductor boom in 2021

2021-01-23

Jiang Shangyi, Vice Chairman of SMIC: Advanced technology and advanced packaging should develop in parallel

2021-01-23

The opportunity that smart cars bring to the semiconductor industry

2021-01-23

The new goal of CHINA IC packaging and testing factories

2021-01-23

Transform the DRAM production line, and use image sensors

2021-01-23

Chips are out of stock, German automakers ask the government for help

2021-01-23

What is the impact of the sudden power outage at the Micron DRAM plant?

2021-01-23

DRAM buyers increase inventory, TrendForce: Q1 is bullish next year!

2021-01-23

MediaTek entered the world's fourth largest IC design company

2021-01-23

Three major IC manufacturers issued price increase notices, which will increase by 30% from January 1, 2021

2021-01-23

Phison memory control IC price increases by 20%

2021-01-23

NAND Flash controller will rise 15%~20%