Verified China supplier - HongRuiXing (Hubei) Electronics Co.,Ltd.
Verified Supplier

HongRuiXing (Hubei) Electronics Co.,Ltd.

HOREXS is a famous Chinese IC substrate manufacturer which professionally produce 2-6L substrate (buildup types) exceeded 10 years.

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2010
Established
100~200
Employees
$50million-100million
Annual Sales
Manufacturer
Business Type
                                                                                                       
Manufacturer
Business Type
       
China
Country
                                                                                                                                                                                                                                                                                                                                                                                                                                                                       
2010
Established
100~200
Employees
                                                                                                                                                                       
50million-100million
Annual Sales
Top Score

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BGA Substrate

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China BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging for sale

BT FR4 NAND Memory Substrate Board 35/35μm 4-Layer ENEPIG for DRAM/SSD/LPDDR Packaging

Price: US 120-150 per square meter
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China Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging for sale

Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging

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China BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness for sale

BGA Memory Substrate with ENEPIG ENIG Surface Finish - 1 mil Line Width, 0.1-0.4mm BT Thickness

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China BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability for sale

BT Material Semiconductor Package Substrate L/S 35/35μm - 0.1-0.4mm Thickness with 20μm Line/Space Capability

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China Horexs 0.2mm Thickness BGA Package Substrate with 25μm Line Width and 0.1-0.4mm FR4 Material for sale

Horexs 0.2mm Thickness BGA Package Substrate with 25μm Line Width and 0.1-0.4mm FR4 Material

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China MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB for sale

MicroLED/MiniLED Package Substrate - 1mil Line Width, 0.1-0.4mm Thickness, 1-6 Layer PCB

Price: US 120-150 per square meter
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China 2-6 Layer BT Material BGA Packaging Substrate 0.18mm Thickness 25μm Line Width for Semiconductor Assembly for sale

2-6 Layer BT Material BGA Packaging Substrate 0.18mm Thickness 25μm Line Width for Semiconductor Assembly

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China BT FR4 4-Layer CSP Substrate with ENEPIG Finish - 25μm Line Width, 0.1-0.4mm Thickness for IC Packaging for sale

BT FR4 4-Layer CSP Substrate with ENEPIG Finish - 25μm Line Width, 0.1-0.4mm Thickness for IC Packaging

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IC Package Substrate

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Price: US 120-150 per square meter
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Delivery Time: 7-10 working days
China 4-Layer BT Material IC Substrate - 25μm Line Width, 0.22mm Thickness for Semiconductor Packaging for sale

4-Layer BT Material IC Substrate - 25μm Line Width, 0.22mm Thickness for Semiconductor Packaging

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China 0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness for sale

0.2mm 2-Layer Memory Card Substrate for IC Encapsulation - 25μm Line Width, 0.29mm Thickness

Price: US 120-150 per square meter
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Delivery Time: 7-10 working days
China Hitachi BT IC Package Substrate 0.29mm Thickness 25μm Line Width for Memory Electronics Manufacturing for sale

Hitachi BT IC Package Substrate 0.29mm Thickness 25μm Line Width for Memory Electronics Manufacturing

Price: US 0.11-0.13 each piece
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Delivery Time: 7-10 working days
China 0.15mm Thickness 2-Layer IC Package Substrate for Memory Cards with 0.32mm Finished Thickness and 25μm Line Width for sale

0.15mm Thickness 2-Layer IC Package Substrate for Memory Cards with 0.32mm Finished Thickness and 25μm Line Width

Price: US 120-150 per square meter
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China FBGA/PBGA/LGA IC Substrate Manufacturing - 25μm Line Width, 0.29mm Thickness, 4-Layer Customizable for sale

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Delivery Time: 7-10 working days
China 25μm Line/Space FBGA Package Substrate for Memory IC - 0.22mm Thickness, 4-Layer Customizable Design for sale

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Price: US 120-150 per square meter
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Delivery Time: 7-10 working days
China Hitachi BT Material IC Substrate 0.29mm Thickness with 25μm Line Width for Memory Electronics Manufacturing for sale

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Sip Package Substrate

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Delivery Time: 7-10 working days
China IC Substrate Manufacturing - 1-6 Layer Build-Up with 25μm Line Width & 0.24mm Thickness for Wearable Electronics for sale

IC Substrate Manufacturing - 1-6 Layer Build-Up with 25μm Line Width & 0.24mm Thickness for Wearable Electronics

Price: US 120-150 per square meter
MOQ: 1 square meter
Delivery Time: 7-10 working days
China 4-Layer IC Substrate BT Material with 25μm Line Width and 0.22mm Thickness for Semiconductor Packaging for sale

4-Layer IC Substrate BT Material with 25μm Line Width and 0.22mm Thickness for Semiconductor Packaging

Price: US 99-120 each piece
MOQ: 1 square meter
Delivery Time: 7-10 working days
Factory Footage

Company Videos

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HongRuiXing (Hubei) Electronics Co.,Ltd.
03:28

HongRuiXing (Hubei) Electronics Co.,Ltd.
HOREXS
04:40

HOREXS
Quality Assured

Certifications

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China quality certification report
quality certification report
China patent certification
patent certification
China patent certification
patent certification
China patent certification
patent certification
China SGS
SGS
China patent certification
patent certification