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China Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging for sale
China Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging for sale

Microelectronics Package Substrate Manufacturing - 1-6 Layers, 0.18mm Thickness, 25μm Line Width for IC & Semiconductor Packaging

Professional IC substrate manufacturing with 600,000 SQM annual capacity. Features 1-6 layer customization, 25μm minimum line width, 0.18mm finished thickness, and support for advanced technologies including wire bonding, embedded memory, and buildup processes. Certified materials from leading brands with custom surface finishes available.

Place of Origin china
Packaging Details carton customized
Color Black
Material BT
Line Space 40um
Supply Ability 30000 square meters per month
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Product Description
Microelectronics Package Substrate Manufacturing
Applications
  • IC Package
  • Semiconductor Package
  • Memory Electronics
  • NAND/Flash Memory
  • Microelectronics Assembly
  • Microelectronics Package
Technical Specifications
Parameter Specification
Minimum Line Space/Width 1 mil (25μm)
Finished Thickness 0.18mm
Copper Weight 0.5oz or Customized
Layers 1-6 Layers (Customized)
Soldermask Green or Customized (TAIYO INK, ABQ)
Material Brands
Main brands: SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic, Others
Surface Finishes
Mainly immersion gold, supports customization including OSP/Immersion silver, tin, and more
Manufacturing Capabilities
HOREXS Manufacturing Facility
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer located in Huangshi City, Hubei Province, China. The facility spans over 60,000 square meters with an investment exceeding $300 million USD.
Production Capacity
Annual IC Substrate Capacity: 600,000 SQM/year
Process Technologies: Tenting & SAP Process
Advanced Technology Capabilities
  • Line/Space: 20/20μm, 10/10μm
  • Materials: BT+ABF
  • Wire Bonding Substrate (BGA)
  • Embedded Memory IC Substrate
  • MEMS/CMOS, Module (RF, Wireless, Bluetooth)
  • 2/4/6 Layer Structures (1+2+1/2+2+2/1+4+1)
  • Buildup (Buried/Blind Hole) Flipchip CSP
  • Other Ultra IC Package Substrate Technologies
Inquiry Requirements
Required Information for Quotation
  1. Substrate production specification information
  2. Gerber files and drilling files
  3. Quantity requirements including samples
  4. For multilayer substrates: layer stack-up/build-up information
Shipping & Logistics
Supported shipping methods: DHL, UPS, FedEx, Air Freight, Custom Express Services
Contact HOREXS Today
For better pricing and superior quality IC substrates, contact HOREXS now. We provide technical support and cost-saving solutions while maintaining high quality standards.

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Interested in this product?
Contact us now for more details and a custom quote.