FR4 Memory IC Substrate 0.24mm Thickness with 10/10μm Line Width for Semiconductor Packaging
High-performance FR4 core IC substrate with 170°C Tg rating and ENIG gold wire bonding surface. Features 10/10μm minimum line width, 12μm copper thickness, and supports memory card, MicroSD, and semiconductor applications. Manufactured by HOREXS with 600,000 SQM annual capacity and advanced manufacturing technologies.
High-performance FR4 core memory IC substrate designed for semiconductor packaging applications, featuring 170°C glass transition temperature and ENIG gold wire bonding surface finish.
- Memory electronics and storage devices
- MicroSD and TF card manufacturing
- IC package and semiconductor electronics
- SD card and memory card production
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 35/35μm - 20/20μm - 10/10μm |
| Finished Thickness | 0.24mm |
| Raw Materials | SHENGYI, Mitsubishi, Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | ENIG/ENEPIG/OSP/Soft Gold/Hard Gold |
| Copper Thickness | 12μm |
| Layer Count | 2 Layer |
| Soldermask/PSR | Green Taiyo brand/AUS 308/AUS 320/AUS 410/SR-1700,300 series |
HOREXS Group operates two manufacturing facilities with combined annual IC substrate capacity of 600,000 square meters. Advanced manufacturing technologies include L/S 20/20μm and 10/10μm capabilities with BT+ABF materials support.
- Wire bonding substrate (BGA)
- Embedded memory IC substrate
- MEMS/CMOS modules (RF, Wireless, Bluetooth)
- 2/4/6 Layer configurations (1+2+1/2+2+2/1+4+1)
- Buildup technology with buried/blind vias
- Flipchip CSP packaging
- Gerber files
- Production specifications
- Buildup/stackup information for multilayer substrates
- Additional supporting documentation
Contact Person: AKEN
Email: [email protected]
Technical support available including roadmap and design rule files.
- DHL / UPS / FedEx express shipping
- Air freight and sea freight services
- Custom express arrangements available
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