IC Package Substrate
Precision 0.15mm IC Package Substrate Fabrication V2 Flame Retardant 4 Layer
High-precision IC substrate with 0.15mm thickness, 1mil line/space, and 4-layer build. Supports immersion gold finish and custom options. Ideal for memory cards, semiconductors, and IC packaging. Manufactured by HOREXS, a leading Chinese IC substrate factory with 600,000 SQM/year capacity and MSAP technology.
BOC Package Substrate for Memory Chip High Speed High Density 1mil Line Space 0.1mm Thickness
High-performance BOC package substrate for memory chips, supporting high speed and high density. Features ultra-fine 1mil line space, 0.1-0.4mm finished thickness, and immersion gold finish. Customizable layers and materials. Ideal for IC packaging, servers, and IoT devices.
Soft Gold MCP CSP Package Substrate BT FR4 0.1-0.4mm Finished Thickness 1-6 Layer
High-density MCP/CSP package substrate with 1mil line/space, 0.1-0.4mm finished thickness, and immersion gold finish. Supports custom materials, layers, and surface treatments. Ideal for IC packaging, smartphones, and IoT devices with 99.7% yield quality.
Precision 0.15mm IC Packaging Substrate 4 Layer Flame Retardant BT Material
High-precision IC substrate with 0.15mm thickness, 1mil line/space, and 4-layer build. Supports immersion gold finish and custom options. Ideal for memory cards, semiconductors, and IC packaging. ISO-certified manufacturer with 600,000 SQM annual capacity.
Customizable IC Package Substrate 0.09mm Thickness 4 Layer BT Material for Memory Card
High-precision IC package substrate with 0.09mm thickness, 4-layer build, and 1mil line space/width. Supports immersion gold finish and custom options. Ideal for DRAM, SD, and memory card applications. Certified manufacturer with 600,000 SQM annual capacity.
BOC Package Substrate for Memory Chip High Speed High Density 1mil Line Space 0.1mm Thickness
High speed high density BOC package substrate for memory chips. Features 1mil line space/width, 0.1-0.4mm finished thickness, and immersion gold finish. Supports custom layers, materials, and surface finishes. Ideal for IC packaging in servers, SSDs, and mobile devices.
Soft Gold MCP CSP Package Substrate BT FR4 0.1-0.4mm Finished Thickness IC Substrate
High-precision MCP/CSP package substrate for semiconductors and IC assembly. Features ultra-thin BT/FR4 (0.1-0.4mm), 1mil line/space, immersion gold finish, and 1-6 layer customization. Ideal for smartphones, IoT, and memory modules with 99.7% yield quality.