IC Package Substrate
DDR IC Package Substrate PCB - 0.2mm Thickness FR4 Material with BGA & Gold Plating for DDR4/LPDDR Applications
High-precision DDR IC package substrate PCBs featuring 0.1-0.4mm thickness, 1mil line spacing, and gold plating. Ideal for mobile devices, wearables, and semiconductor packaging with 99.7% quality yield. Customizable layers, materials, and surface finishes with global shipping support.
JEDEC Standard eMCP IC Substrate Fabrication - 25μm Line Width, 0.29mm Thickness, 4-Layer Customizable Design
Professional JEDEC-compliant eMCP IC substrate manufacturing with 25μm minimum line width and 0.29mm finished thickness. Customizable 4-layer designs support memory cards, wearable electronics, and embedded systems. Advanced manufacturing capabilities include BT+ABF materials, 600,000 SQM annual capacity, and comprehensive technical support for semiconductor packaging applications.
Bright Gold 0.2mm Multilayer IC Substrate with 25μm Line Width and 0.3mm Thickness for Semiconductor Packaging
Professional 4-layer IC substrate with 0.2mm bright gold finish and 25μm minimum line width. Features 0.3mm thickness, customizable copper weight, and multiple surface finish options. Ideal for semiconductor packaging, memory cards, and wearable electronics with advanced manufacturing capabilities including 10/10μm technology and BT+ABF materials.
Ultra Thin FR4 Multi-Layer PCB for Memory Card Encapsulation - 0.29mm Thickness, 1mil Line Width
Professional FR4 multi-layer PCB substrate for memory card encapsulation and IC packaging. Features 0.29mm finished thickness, 1mil line width precision, and customizable 4-layer construction. Manufactured by HOREXS with 600,000 SQM annual capacity, supporting advanced semiconductor applications including MicroSD cards and wearable electronics.
4-Layer Gold Bonding IC Package Substrate 0.29mm Thickness 25μm Line Width OEM ODM Manufacturing
Professional 4-layer IC package substrate with 0.29mm thickness and 25μm minimum line width. Features immersion gold surface finish, customizable layers, and supports memory cards, semiconductor packaging, and wearable electronics. HOREXS manufacturing with 600,000 SQM annual capacity and advanced BT+ABF materials.
4L Build-Up IC Package Substrate 0.8mm Gold Surface 0.29mm Thickness for Memory Electronics and Semiconductor Applications
Professional 4-layer build-up IC package substrate with 0.8mm gold surface finish and 0.29mm thickness. Features 1mil line spacing, customizable materials from leading brands, and supports DRAM memory, storage ICs, and wearable electronics. Manufactured by HOREXS with 600,000 SQM annual capacity and advanced 20/20μm technology.
BGA IC Package Substrate with 0.29mm Thickness and 25μm Line Width - MGC BT Material for Semiconductor Packaging
High-performance IC substrate featuring 0.29mm thickness and 25μm minimum line width, manufactured using MGC BT materials. Supports memory cards, wearable electronics, and NAND/Flash memory packages with customizable specifications. Produced by HOREXS with 600,000 SQM annual capacity and advanced Tenting & SAP processes for superior semiconductor packaging solutions.
HOREXS Semiconductor IC Package Substrate with 25μm Line Width and 0.29mm Thickness for Wire Bonding Applications
Professional IC substrate solutions featuring 1mil (25μm) minimum line width, 0.29mm finished thickness, and 600,000 SQM annual capacity. Supports wire bonding, embedded memory, and flipchip CSP packaging with customizable materials and surface finishes. Advanced manufacturing capabilities include BT+ABF materials and fine line technology for memory cards, wearable electronics, and semiconductor applications.
Precision 0.15mm IC Packaging Substrate with 25μm Line Width and 0.29mm Thickness for Semiconductor Applications
Advanced 0.15mm IC packaging substrate featuring ultra-fine 25μm line width, 0.29mm thickness, and 600,000 SQM annual manufacturing capacity. Supports wire bonding, embedded memory, MEMS/CMOS modules with customizable materials and surface finishes. HOREXS Group provides technical support for semiconductor packaging applications.
IC Substrate for IoT Electronics 4 Layer 25um Line Space FCBGA FCCSP NandFlash Memory
High-performance IC substrate for IoT, smartphones, and automotive electronics. Features 25um line/space, 4-layer build, immersion gold finish, and SHENGYI/Mitsubishi materials. Supports FCBGA, FCCSP, and memory packages. Custom options available. HOREXS ensures high quality and competitive cost.
FCBGA BGA IC Substrate Manufacturer 25um Line Space 4 Layer Custom
HOREXS manufactures high-quality FCBGA and BGA package substrates with 25um line space and 4-layer custom options. Features MSAP technology, immersion gold finish, and 600,000 SQM annual capacity. Ideal for semiconductors, memory, and automotive electronics. Competitive pricing with fast global shipping.
FBGA PBGA LGA IC Substrate Semiconductor Package 4 Layer 25um Line Space
High-density IC substrate for FBGA/PBGA/LGA packages. Supports 25um line/space, 4-layer build-up, and immersion gold finish. Ideal for memory, RF, and automotive electronics. Custom options available with fast delivery.
Memory IC Substrate Manufacture for DDR LPDDR FCBGA FCCSP 4 Layer 25um Line Space
HOREXS manufactures high-quality memory IC substrates for DDR/LPDDR, FCBGA, and FCCSP packages. Features 25um line/space, 4-layer build-up, immersion gold finish, and BT/ABF materials. ISO-certified, 600,000 SQM annual capacity, with custom options and fast global shipping.
FCCSP Flipchip Package Substrate 4 Layer 25um Line Space IC Substrate
High-quality FCCSP flipchip package substrate with 25um line space/width and 0.29mm finished thickness. Supports custom layers, surface finishes, and materials. Ideal for IC packaging, memory, and automotive electronics. Competitive pricing with fast delivery.
MEMS Package Substrate Manufacture 4 Layer 25um Line Space Width IC Substrate
High-quality MEMS package substrate for FCBGA, FCCSP, and memory ICs. Features 25um line space/width, 4-layer build, and immersion gold finish. Customizable options with fast delivery. HOREXS ensures cost savings with same high quality guarantee.
FCBGA BGA IC Substrate Manufacturer 25um Line Space 4 Layer Custom
HOREXS manufactures high-quality FCBGA and BGA package substrates with 25um line space and 4-layer custom options. Features MSAP technology, immersion gold finish, and 600,000 SQM annual capacity. Ideal for semiconductors, memory, and automotive electronics. Competitive pricing with full technical support.
Semiconductor FCCSP Package Substrate 4 Layer 25um Line Space IC Substrate
High-quality FCCSP package substrate with 25um line space/width and 0.29mm finished thickness. Supports custom layers, surface finishes, and materials. MSAP and Tenting processes ensure fine patterns and reliability. Ideal for memory, RF, and automotive ICs. Competitive pricing with fast delivery.
Precision 0.15mm IC Packaging Substrate 4 Layer Electrolytic Foil Processing
High-precision 4-layer IC substrate with 0.15mm thickness and 25um line space/width. Supports MSAP and Tenting processes, immersion gold finish, and custom options. Ideal for memory cards, semiconductors, and IC packaging. Certified quality, fast delivery.
Hitachi BT IC Package Substrate 0.29mm 4 Layer 0.5oz Copper Custom
High-density IC substrate for memory and semiconductor packaging. Features 0.29mm thickness, 4-layer build, 0.5oz copper, and 1mil line space/width. Supports custom surface finishes and materials. Ideal for DDR, flash, and microSD applications.
eMMC IC Package Substrate PCB BGA Gold Plating 0.2mm Finished FR4
High-precision IC substrate for eMMC packaging. Features 0.2mm finished FR4, BGA gold plating, 1mil line/space. Supports custom layers, soldermask, and surface finish. Ideal for semiconductors, wearables, and consumer electronics. Stable quality with 99.7% yield.