Phase Changing Materials
TIC800H Low-Melting Thermal Interface Material Phase Change Sheet 7.5 W/mK in 0.008-0.012 inch Thickness
TIC800H thermal interface material features 7.5 W/mK thermal conductivity and phase change at 50°C-60°C for superior heat dissipation. Self-adhesive design eliminates need for additional adhesives. Ideal for power conversion equipment, battery systems, and communication hardware. Available in standard thicknesses 0.008", 0.010", and 0.012" with UL94 V-0, SGS, and ROHS compliance.
TIC800G Low-Melting CPU Thermal Pad - 5.0 W/mK Conductivity, 0.005-0.012 Inch Thickness Options
High-performance phase change thermal pad with 5.0 W/mK conductivity and 50°C softening temperature. Self-adhesive design eliminates need for additional adhesives. Available in multiple thicknesses from 0.005" to 0.012" for laptop CPUs, power conversion equipment, and LED systems. Operating range -40°C to 125°C with low thermal resistance.
TIC800D Low-Melting Thermal Interface Material Pad 0.127mm Thickness 1.6 W/mK Conductivity for Motor Control
TIC800D thermal interface material features 1.6 W/mK thermal conductivity and 5000 VAC dielectric strength. This phase change thermal pad softens at 50-60°C to fill surface irregularities, reducing thermal resistance in power semiconductors, automotive devices, and electric motor control equipment. Custom thickness and die-cut shapes available.
TIC800K-A1 RoHS Phase Change Thermal Material 1.5W/mK Conductivity 0.125mm-0.150mm Thickness
High-performance phase change thermal interface material with 1.5 W/mK conductivity and RoHS compliance. Features self-adhesive design, low thermal resistance, and operates from -40℃ to 150℃. Ideal for laptops, power conversion equipment, LED systems, and communication hardware with custom die-cutting options available.
TIC800G-ST 5.0W/mK Phase Change Silicone Thermal Pad for Laptop CPU GPU Cooling - 0.005" to 0.012" Thickness
High-performance thermal interface material with 5.0W/mK conductivity and 0.014℃-in²/W thermal resistance. Phase change technology softens at 50°C to fill surface irregularities, naturally tacky without adhesive. Ideal for laptops, microprocessors, and LED systems with excellent thermal cycling stability.
TS-Ziitek-Sharp Metal X01 Phase Change Thermal Interface Material - 18.9 W/mK Conductivity, 8.0 g/cm³ Density for Microprocessors
Advanced alloy phase change thermal interface material with 18.9 W/mK thermal conductivity and 8.0 g/cm³ density. Features non-toxic composition, excellent stability, and phase change temperature above 60°C. Ideal for microprocessors, chipsets, and graphic processing chips. Certified ISO9001:2015, UL94 V-0, and ROHS compliant.
TIC800A-AL Low Melting Point Thermal Phase Change Material 2.5 W/mK Conductivity for Memory Modules
TIC800A-AL thermal phase change material features 2.5 W/mK thermal conductivity and phase change at 50°C. With 0.021℃-in²/W thermal resistance and natural tackiness, it eliminates need for adhesives or preheating. Ideal for memory modules, power supplies, and automotive electronics with excellent thermal stability.
TIC800K High Thermal Conductivity Phase Change Material 1.6 W/mK for Motherboards and Power Semiconductors
TIC800K thermal phase change material provides 1.6 W/mK thermal conductivity with dielectric breakdown voltages up to 6000 VAC. This Kapton-reinforced insulator features low thermal resistance, high voltage isolation, and phase change activation at 50°C for superior thermal management in electronics applications.
TIC800G Low Thermal Resistance Phase Change Material 5.0W/mK with 0.005-0.012" Thickness Options
TIC800G thermal phase change material offers 5.0W/mK conductivity and low 0.014℃-in²/W thermal resistance. Features natural tackiness, no adhesive requirement, and stable performance through 500 thermal cycles. Ideal for notebooks, power supplies, automotive electronics, and IT infrastructure applications.
TIC800A 2.5W/mK Thermal Phase Change Material with 50°C Transition Temperature and 0.005-0.020" Thickness Options
High-performance thermal interface material featuring 2.5W/mK conductivity and 50-60°C phase transition for superior heat dissipation. Self-adhesive design eliminates need for additional adhesives. Available in multiple thicknesses from 0.005" to 0.020" for power conversion, LED systems, and computing applications.
TIC800R-SP Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment
Low Thermal Resistance Phase Change Thermal Paste For Server And Data Center Equipment Products description TIC®800R-SP is a paste like thermal phase change material that can undergo phase transition at operating temperature, fully filling_the micro voids at the contact interface, thereby significantly improving thermal conductivity eficiency. The material adopts a sturdy polymer phase change structure, exhibiting excellent wetting properties within a typical operating
TIC800T 9.6W/mK Thermal Conductive Phase Change Material 0.20mm 0.25mm for Electrical Products
Ultra-high thermal conductivity phase change material with 9.6W/mK and low thermal impedance. Softens above 50°C to fill gaps, reducing thermal resistance. Ideal for CPUs, GPUs, and power converters. Custom sizes available. RoHS/UL compliant.
TIC800P-K1 Thermal Conductive Phase Change Material with 1.6W/mK Conductivity and 0.004-0.006 Inch Thickness
High-performance thermal interface material with ceramic-filled compound on MT Kapton film. Features 1.6W/mK thermal conductivity, dielectric strength up to 5000VAC, and thermal impedance as low as 0.12℃-in²/W. Ideal for automotive electronics, LED systems, and IT infrastructure cooling applications.
TIC800P Low Melting Point Thermal Interface Material 0.95W/mK Conductivity 50-60°C Phase Change
TIC800P thermal interface material offers 0.95W/mK thermal conductivity with phase change at 50-60°C. Features 0.021℃-in²/W thermal resistance, natural tackiness without adhesive, and excellent reliability through 1000 hours at 130°C. Ideal for automotive electronics, power adapters, and LED systems requiring efficient heat dissipation.
TIC800H 7.5W/mK Thermal Conductive Phase Change Material 0.20mm for AI 5G Devices
Ultra-high thermal conductivity phase change material with 7.5W/mK and low steady-state thermal resistance. Softens above 50°C to fill gaps, forming efficient heat channels. Ideal for CPUs, GPUs, and power equipment. Custom shapes available. ISO9001 certified.
TCP820P Phase Change Thermal Interface Material 0.95W/mK Conductivity 0.020" Thickness
TCP820P low melting point thermal interface material provides efficient heat transfer with 0.95W/mK thermal conductivity and 0.183°C-in²/W thermal resistance. Features natural tackiness without adhesive, operates from -25°C to 125°C, and maintains performance through 1,000 hours at 130°C. Ideal for automotive electronics, IT infrastructure, and portable devices.