Company Cases
Company Cases
Explore our successful projects and client case studies.
Our Projects
32 Cases
2026-08-26
ZIITEK Thermally Conductive Plastics: Driving Innovation in Thermal Management Through Lightweight Design and Efficient Heat Dissipation
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2026-08-12
Ziitek's TIG7835L liquid metal thermal conductive material empowers AI servers with ultra-high computing power cooling capabilities.
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2026-08-05
What Are Thermal Pads Used for? Core Functions and Practical Applications
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2026-07-21
Solving two major problems of 5G equipment: Integrated thermal and anti-radiation materials that balance heat dissipation and radiation suppression core principle
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2026-07-16
Analysis of 90% engineers' misunderstanding in choosing thermal conductive silica pad.
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2026-07-07
TIG7835N Liquid Metal Thermal Conductive Paste | Anti-vibration and Anti-overflow, covering the whole scene of 5G/vehicle/3C/industrial control.
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2026-06-26
New Energy Vehicle Battery Pack Sealing & Thermal Management Solution
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2026-06-17
Low-Outgassing Thermal Pads Meet the Growing Thermal Management Demands of High-End and Long-Life Electronic Devices
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2026-06-05
How to choose thermal conductive materials for portable/wearable devices? ZIITEK graphite sheets unlock a new lightweight and efficient cooling solution.
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2026-05-18
Thermal Management of High-Power Electronic Devices: The Advantages of Using Ziitek High Thermal Conductivity Adhesive
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2026-04-08
Ziitek thermal and absorbing wave material: Empowering stable operation of electronic devices
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2026-03-24
The "savior" for the heat dissipation of AI chips, Ziitek carbon fiber Thermal conducting pad has a heat conductivity coefficient of up to 25w/m.k and a thermal resistance as low as 0.05 ℃.cm²/w.
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2026-03-10
The preferred solution for IGBT thermal management: Ziitek TIS thermal conductive and insulating silica gel sheet, a one-stop solution for thermal conductivity and insulation.
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2026-02-26
Energy storage station "heat dissipation guardian" - TIS thermal conductive encapsulation adhesive
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2026-02-09
High heat dissipation, worry-free sealing! ZIITEK thermal conductive epoxy potting compound helps upgrade the performance of communication and aerospace connectors.
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2026-01-27
GPU Heat Dissipation Core: Full Analysis of Ziitek's Three Commonly Used Thermal Interface Materials (TIM)
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2026-01-05
Thermal Conductive Potting Compound Using Guide: Accurate operation procedure & Key precautions
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2025-12-08
"High thermal conductivity, insulation, and shock resistance!" The triple core of the thermal conductive silicone sheet has built a solid defense line for the thermal management of unmanned aerial vehicles.
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2025-11-06
Ultra-thin and customizable: The key to breaking the deadlock of heat dissipation in narrow spaces with thermal silicone sheets
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2025-10-10
Not only about expansion, but also about innovation! Kunshan Ziitek's new base builds a new highland for the research and development of Al server thermal management
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2025-09-05
Uneven heat generation in components? Thermal conductive potting compound can evenly distribute heat throughout, saying goodbye to local overheating!
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2025-08-04
With the rapid increase in AI computing power, how can thermal graphite sheets break the "high-temperature shackles" of tablet computers?
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2025-07-21
"Invisible Heat-dissipating Guardian" in Mobile Phone: Artificial Graphite Sheet
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2025-07-08