Electronics X Ray Machine
Full-angle Rotary Detection + Precise 2D&3D Imaging SMT PCBA Processing X-ray UNICOMP AX9100VS
UNICOMP AX9100VS X-ray Inspection System Full-angle Rotary Detection + Precise 2D & 3D Imaging SMT PCBA Processing X-ray System Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis manipulation with any angle Batch mode positioning inspection Closed tube
360° Rotary Observation High Clear 2D 3D Scan Electronics Assembly Manufacturing X-ray UNICOMP AX9100VS
UNICOMP AX9100VS 360° Rotary Observation X-ray Inspection System Advanced 360° rotary observation high clarity 2D/3D scanning X-ray system for electronics assembly manufacturing and industrial inspection applications. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction
High specifications electronic boards 2D 2.5D X-ray machine Unicomp AX9100MAX with 360 degrees rotation table
High Specifications Electronic Boards 2D 2.5D X-ray Machine Unicomp AX9100MAX 130KV micron focus spot size tube X-ray machine Unicomp AX9100 with dual computers for PCB BGA inspection. Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages Fuses, power diodes, multilayer
130KV micron focus spot size tube X-ray machine Unicomp AX9100MAX with dual computers for PCB BGA inspection
Unicomp AX9100MAX X-Ray Inspection System 130KV micron focus spot size tube X-ray machine with dual computers for high-precision PCB and BGA inspection. Optimized for non-destructive testing of semiconductors and electronics, providing comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules,
SMT PCB X-ray machine high resolution micron focus spot size Unicomp AX9100MAX for BGA voids measurement
SMT PCB X-ray Machine - Unicomp AX9100MAX High-resolution micron focus spot size X-ray system optimized for BGA voids measurement and comprehensive non-destructive testing of semiconductors and electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors, wiring harnesses, and photovoltaic components. System Specifications Footprint1450
CNC programable automatic inspection Electronics X-ray machine Unicomp AX9100MAX for IC curvature measurement
CNC Programmable Automatic Inspection Electronics X-ray Machine Unicomp AX9100MAX Optimized for high-precision non-destructive testing of semiconductors and electronics, the AX9100MAX provides comprehensive inspection capabilities for IC curvature measurement and various electronic components. Applications BGA, CSP, flip chips, LED packages, fuses, power diodes, multilayer PCBs, discrete semiconductors, lithium battery modules, precision castings, automotive connectors,
High magnifications PCB X-ray machine Unicomp AX9100MAX for electronics IC components bonding wire inspection
High Magnifications PCB X-Ray Machine Unicomp AX9100MAX Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, covering BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, and lithium battery
AX7900 Unicomp 90KV X-ray Inspection for IC Bond Wire and Internal Structure
AX7900 Unicomp 90KV X-ray Inspection System The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It includes standard XY multi-axis motion
Unicomp 90KV 2D X-ray Inspection for BGA Void Analysis AX7900
Unicomp 90KV 2D X-ray Inspection for BGA Void Analysis AX7900 The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It includes standard XY
IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning
IC BGA CSP Packaging Defect Inspection X-ray AX8300 UNICOMP Full CNC Automatic Scanning The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient
IC BGA CSP QFN Packaging Inspection X-ray AX8300MAX UNICOMP 4K Flat Panel Detector
AX8300MAX X-ray Inspection System Advanced industrial X-ray inspection system engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution
Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control
Semiconductor BGA Flip Chip Inspection X-ray AX8300 UNICOMP Fingerprint Access Control The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient
Inspect Measure Solder Joint PCBA UNICOMP Electronics X-Ray AX7900
UNICOMP AX7900 X-Ray Inspection System The Unicomp AX7900 90KV X-ray inspection system is specifically engineered for cable terminal crimp quality assessment and comprehensive electronic component analysis, providing precise inspection capabilities for various industrial applications. System Overview The AX7900 features a 90kV/5μm micro-focus X-ray tube and high-performance FPD detector in a multifunctional workstation design. It includes standard XY multi-axis motion with
Real-Time Radiation Safety Monitoring BGA AX8300MAX UNICOMP Fingerprint Recognition Login
AX8300MAX UNICOMP X-ray Inspection System Advanced industrial X-ray inspection system with fingerprint recognition login, delivering ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum
360° Horizontal Rotary Stage Detector Max 60° Unilatera X-ray AX8300MAX UNICOMP High-Speed CNC Batch Scan
AX8300MAX UNICOMP High-Speed CNC X-ray Inspection System This advanced industrial X-ray inspection system is specifically engineered for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications This inspection system is extensively deployed for quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core
110kV Sealed Tube 50° Tilt X-ray Detector AX8300 Unicomp Crimp Joint Void Inspection Equipment
AX8300 110kV Sealed Tube X-ray Inspection System The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and excessive
Automated High-Speed CNC Positioning Automatic X-ray AX8300MAX UNICOMP Dual-Channel Access Control
Automated High-Speed CNC Positioning Automatic X-ray AX8300MAX UNICOMP Dual-Channel Access Control Advanced industrial X-ray inspection system with fingerprint recognition login, delivering ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces. Applications Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip,
BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring
BGA Void Bridging Missing Ball Detection X-ray AX8300 UNICOMP Real-Time Safety Monitoring The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP
Bubble Ratio Measurement SMT Electronic BGA Component Inspection X-ray AX8300 UNICOMP The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient