Electronics X Ray Machine
High-Precision BGA QFN X-ray AX8300 UNICOMP 5μm Min Resolution Flat Panel Detector
High-Precision BGA QFN X-ray AX8300 UNICOMP 5μm Min Resolution Flat Panel Detector The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration
Unicomp AX8300 Xray Inspection Machine 110kV Sealed Tube for Wire Harness Cable
Unicomp AX8300 X-ray Inspection Machine Professional 110kV sealed tube X-ray inspection system designed for high-precision non-destructive testing of wire harness cables, PCBA, SMT assemblies, and electronic components. System Overview The Unicomp AX8300 bridges the performance gap between conventional 90kV and 130kV X-ray systems, providing optimal penetration power for comprehensive inspection without energy waste. Equipped with a high-end flat-panel detector and full 360°
Checking Void Defects Daily Consume Battery UNICOMP 130kV X-RAY Inspection AX9100
UNICOMP AX9100 X-Ray Inspection System Advanced 130kV X-ray inspection system for detecting void defects in daily consumer batteries and electronic components with high precision geometric magnification. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with navigation mode detection 7
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine
Omni-directional Bond Wire Inspection IC X-ray AX9100 UNICOMP Precision Component Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
Lithium Battery Xray Inspection Machine AX8300 Unicomp Internal Flaw Testing Equipment
Lithium Battery X-ray Inspection Machine AX8300 The Unicomp AX8300 is a purpose-engineered offline micro-focus X-ray non-destructive testing system, specially optimized for high-precision quality control across PCBA, SMT assembly, semiconductor packaging and miniature electronic component manufacturing. Developed to fill the performance gap between mainstream 90kV and 130kV X-ray inspection equipment, it integrates Unicomp's proprietary self-developed 110kV sealed micro-focus
5μm Focus Spot PCBA Plated Through Hole Xray Inspection Machine AX8300 Unicomp PTH Void Defect Detector
5μm Focus Spot PCBA Plated Through Hole X-ray Inspection Machine AX8300 The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment
Unicomp X-ray AX8300MAX Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 5 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel 6.
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System
Unicomp X-ray AX8300VS Multi-mode 3d Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. precise detection inspection of tiny defects 2. multi-mode 3d reconstruction 3. synchronized 7-axis manipulation with any angle 4. batch mode positing inspection 5. closed tube with maintenance-free x-ray source 6.
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment
Unicomp X-ray AX8300 Plus Semiconductor Microfocus X-ray Inspection Equipment Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Dedicated semiconductor, resolution 2 µm 2. Large detection range, batch detection efficiency 3. Double rocker design easy to operate 4. Compatible with 2D, 2.5D, Extensible 3D 5. Dual screen design, multi-task parellel
130KV Industrial X-ray Inspection Machine for BGA, PCBA and Solder Voiding Detection AX9100MAX UNICOMP
130KV Industrial X-ray Inspection Machine for BGA, PCBA and Solder Voiding Detection AX9100MAX UNICOMP This system sees extensive deployment across diverse inspection scenarios including BGA, CSP, flip chip, LED, fuses, diodes, PCBs, discrete semiconductors, lithium batteries, miniature metal castings, electronic connector assemblies, wiring harnesses, photovoltaic components, and other microelectronic products. Functions and Feature Inspection Image System Summary Footprint
SMT PCB X-ray Machine Micron Focus Spot Size For BGA Voids Measurement And Solder Past Climbing Height Inspection
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields Functions and Feature Inspection Image System Summary Footprint 1450(W)×1680(D)×1850(H)mm Machine Weight 2400 kg Power Supply 220AC/50Hz Packaging Dimension 1710(W)×1950(D)×1875(H)mm Power Consumption 3.5 kW Packing Weight 2600 kg X-Ray Tube Tube Type Type Sealed type Max.
Real-Time X-Ray Machine With 5 Micron Focus X-Ray Tube For BGA Soldering Balls Checking
X-Ray Inspection Machine Electronics BGA Standard Multifunction Unicomp Technology has a dedicated pool of local and foreign senior professional R & D engineers with extensive experience in high level science and technology. The company is undertaking major national special project (namely “02” project and “863” project) and X-ray detecting equipment R&D in new fields of application. It also works closely with The Chinese academy of sciences, Tsinghua University etc. to
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System
Unicomp X-ray AX9100vs Multi-mode 3D Micro-focus X-ray Analyze Inspection System Application BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die casting ,molded plastic; Ceramic products and other special industries. Features 1. Precise detection inspection of tiny defects 2. Multi-mode 3D reconstruction 3. Synchronized 7-axis manipulation with any angle 4. Batch mode positioning inspection 5. Closed tube with maintenance-free X-ray source 6.
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine
60° Tilt Multi-angle Scan Hidden Solder Defect Detection PCBA BGA X-ray AX9100 UNICOMP Semi Testing Machine Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1000X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment
High Definition 2.5D Imaging Overlapped Void BGA X-ray AX9100 UNICOMP SMT Assembly Inspection Equipment Product Overview The Unicomp AX9100 represents advanced X-ray inspection technology for comprehensive SMT assembly quality control, featuring high-definition 2.5D imaging and specialized void detection capabilities for BGA components. Key Features 130KV 7μm X-Ray tube for precise imaging High-speed, high-resolution FPD with millions of pixels 1000X magnification with high
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array
Unicomp AX9100max Electronics X Ray Machine FOR Ball Grid Array The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and serves a broad range of industries, including: BGA/CSP/Flip Chip packaging LED & optoelectronic components Fuse & diode manufacturing PCB & semiconductor assembly Battery production Small metal castings Electronic connector modules & cables Photovoltaic (PV) cell inspection Application Fields Application fields
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell
Unicomp AX9100max X-ray Machine For EV Cylindrical Cell The Unicomp AX9100max X-ray Machine is designed for EV Cylindrical Cell inspection and is widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields diagram of Unicomp X-ray AX9100max Functions and Features Functions and features diagram of Unicomp X-ray AX9100max
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell
Unicomp AX9100max X-ray Machine For Cylindrical Power Cell Widely applied for BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Application fields of Unicomp X-ray AX9100max Functions and Features Functions and features of Unicomp X-ray AX9100max Inspection Image Sample inspection image from Unicomp X-ray AX9100max Technical Parameters and
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Inspection System is engineered specifically for IGBT module analysis and finds broad application across industries such as BGA/CSP/Flip Chip packaging, LED and optoelectronic component manufacturing, fuse and diode production, PCB and semiconductor assembly, battery fabrication, small metal casting inspection, electronic connector modules and cable testing, and photovoltaic (PV) cell quality
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing
Unicomp AX9100max X-ray Machine 130kV For IGBT Testing The Unicomp AX9100max X-ray Machine is designed for IGBT inspection and widely applied in various industries including BGA, CSP, Flip Chip, LED, Fuse, Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, and Photovoltaic Industry. Application Fields Functions and Features Inspection Image Technical Parameters and Specifications Dimensions and Appearance