Electronics X Ray Machine
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment
7μm Imaging IC Bonding Wire Break Xray AX9100 UNICOMP Semiconductor Chip Packaging Testing Equipment Advanced X-ray inspection system designed for comprehensive defect detection in electronic components and industrial applications. Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with
Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 LED
UNICOMP AX9100 X-ray Inspection System Rotary Detection Precise Geometric Magnification Chip Production X-ray UNICOMP AX9100 IC Inspection System Key Features 130KV 7μm X-Ray tube for precise imaging High speed & millions pixels high resolution FPD 1600X magnification with high-definition real-time image display One-button operation with 2.5D image display Off-line programming function with navigation mode detection 7 axis linkage with 70 degree tilt detection capability
Unicomp AX8300 High Precision Xray Inspection Machine 110kV Sealed 5μm Micro Focus Tube for IC
Unicomp AX8300 High Precision X-ray Inspection Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of 90kV equipment and
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine
High Precision IC AX8300 Unicomp 5μm Micro Focus 110kV Sealed Tube X-ray Machine The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration
110kV Sealed Tube 5μm Micro Focus X-ray Equipment High Precision AX8300 Unicomp
110kV Sealed Tube 5μm Micro Focus X-ray Equipment High Precision AX8300 Unicomp The Unicomp AX8300 is a professional, purpose-built X-ray inspection system designed for high-precision non-destructive testing in PCBA, SMT and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices, providing balanced penetration power to solve insufficient penetration of
Intelligent Multi-view X-ray UNICOMP AX9100VS Head-in-Pillow Effect Solder Ball Crack Detection
UNICOMP AX9100VS Intelligent Multi-view X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Specializes in Head-in-Pillow Effect and Solder Ball Crack Detection. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features
ACT 3D Reconstruction Technology High Accuracy Defect Analysis For PCBA PTH Capacitor UNICOMP AX9100VS
UNICOMP AX9100VS X-ray Inspection System Advanced 3D reconstruction technology for high-accuracy defect analysis in PCBA PTH capacitor inspection and comprehensive semiconductor production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, and Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny
High Resolution 3D CT Imaging For PCBA PTH Capacitor UNICOMP AX9100VS X-ray Inspection
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction capabilities
AI Automatic Measurement 3D CT Layer Scanning UNICOMP AX9100VS Void Rate Head-in-Pillow Defect Inspection
AI Automatic Measurement 3D CT Layer Scanning UNICOMP AX9100VS Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstructio
PCBA Through-hole Capacitor UNICOMP AX9100VS X-ray Machine Offline SMT PCBA Quality Inspection Equipment
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip inspection Automotive Components and New Energy Industry Aluminum Die Casting and Molded Plastic components Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction capabilities
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits
Full 3D Inspection of BGA Bumps Unicomp AX9100vs Die & Internal Circuits Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized
160KV Open Tube X-ray Inspection Unicomp AX9600 for Bond Wire and Die Attach Analysis
UNICOMP AX9600 160KV Open Tube X-ray Inspection System The UNICOMP AX9600 160KV microfocus X-ray inspection system features a proprietary 160kV high-power open-type microfocus X-ray tube, achieving an ultra-fine focal spot of merely 0.8 μm. With maximum geometric magnification of 2000× and superior X-ray penetrability, this system enables precise void fraction quantification for TVS diodes and serves as a high-accuracy inspection solution for advanced IC packaging, HBM
130KV 3D CT X-ray System for BGA Internal Structure Inspection Unicomp AX9100VS
130KV 3D CT X-ray System for BGA Internal Structure Inspection Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis
UNICOMP AX9100VS Multi-Layer All-in-one Imaging Circuit Board Quality Testing X-ray
UNICOMP AX9100VS Multi-Layer All-in-one Imaging Circuit Board Quality Testing X-ray Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction
General Electronics PCBA Production X-ray UNICOMP AX9100VS SOP Lead Solder Void Bridging Inspection
UNICOMP AX9100VS X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip; Automotive Components and New Energy Industry; Aluminum Die Casting, Molded Plastic; Ceramic Products and other special industries. Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis manipulation with any
Ultra High Precision Zoom 2D 2.5D 3D Scanning UNICOMP AX9100VS Automotive Electronics PCB Assembly Xray
UNICOMP AX9100VS Ultra High Precision X-ray Inspection System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis
Solder Joint Hidden Damage Detection LED Driver X-ray Inspection Equipment AX9100max Unicomp
AX9100MAX X-ray Inspection Equipment High-accuracy nondestructive detection system for analyzing electronic IC parts, bonding wires, and solder joint hidden damage in LED drivers and electronic components. System Overview This advanced X-ray inspection equipment performs precise nondestructive testing for semiconductor and industrial applications. Suitable for automotive electronics, new energy, photovoltaic, and high-density microelectronics manufacturing with comprehensive
Inner Defect Scanning & Positioning Water Heater Heating Element Fault Inspection X-ray AX9100max Unicomp
AX9100MAX X-Ray Inspection System Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. Applications This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications, including BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer PCBs, discrete semiconductors, lithium battery assemblies,
Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp
Clear Inner Structure Scanning Mouse Scroll Wheel Defect Inspection X-ray AX9100max Unicomp Advanced X-ray inspection system for electronics IC components and bonding wire analysis with high precision non-destructive testing capabilities. This system is widely deployed for high-precision non-destructive inspection across extensive industrial and semiconductor applications. Applications Covers BGA, CSP, flip chips, LED packaging components, fuses, power diodes, multi-layer
Full-angle Rotary Detection Semiconductor Packaging PCBA X-ray UNICOMP AX9100VS QFN Thermal
UNICOMP AX9100VS Full-Angle Rotary Detection X-ray System Advanced X-ray inspection system designed for comprehensive semiconductor and PCBA production analysis with full-angle rotary capabilities. Applications BGA, CSP, LED, Flip Chip Automotive Components and New Energy Industry Aluminum Die Casting, Molded Plastic Ceramic Products and other special industries Key Features Precise detection inspection of tiny defects Multi-mode 3D reconstruction Synchronized 7-axis