Rigid‑Flex PCB
High Power Thermal Management Rigid-Flex PCB with Heavy Copper and Aluminum Base
This high-power rigid-flex PCB is engineered for applications requiring efficient thermal management and high current-carrying capacity. The hybrid construction integrates heavy copper layers (up to 4oz) with an aluminum core base for superior heat dissipation in power electronics. The rigid sections provide stable mounting for power semiconductors and heat sinks, while the flexible sections connect to control circuits and sensors. Designed for industrial motor drives, power
High Reliability Industrial Grade Rigid-Flex PCB with Extended Temperature Range for Automation
This industrial-grade rigid-flex PCB is engineered for demanding automation and control applications requiring extended temperature operation, vibration resistance, and long-term reliability. Manufactured to IPC-6013 Class 2/3 standards, this board operates reliably across -40°C to +125°C temperature ranges while withstanding moisture, chemical exposure, and mechanical stress. The hybrid construction features a polyimide flex core with high-Tg FR-4 rigid sections, supporting
Aerospace Grade Rigid-Flex PCB MIL-PRF-50884 Compliant High Vibration Resistance Wide Temperature Range
This aerospace-grade rigid-flex PCB is manufactured to meet the demanding requirements of avionics, satellite systems, and communication equipment. Compliant with MIL-PRF-50884 and IPC-6013 Class 3 standards, this board delivers exceptional reliability in environments subject to extreme temperature cycling (–55°C to +125°C), high vibration, and mechanical shock. The hybrid construction integrates rigid FR-4 sections for stable component mounting with flexible polyimide
High Speed Signal Integrity Rigid-Flex PCB with Controlled Impedance for 5G and Data Communication
This high-speed rigid-flex PCB is engineered for telecommunications and data communication applications requiring superior signal integrity at high frequencies. The hybrid construction integrates low-loss polyimide flex sections with advanced rigid materials (including Rogers and PTFE laminates) to maintain signal quality across rigid-to-flex transitions. With tight controlled impedance tolerance (±5%), insertion loss and return loss optimized for high-speed interfaces up to
Ultra-Thin Wearable IoT Rigid-Flex PCB with 3D Packaging and Low Profile for Consumer Electronics
This ultra-thin rigid-flex PCB is specifically engineered for consumer electronics and IoT devices where space, weight, and form factor are critical constraints. With a total profile as thin as 0.3mm and flexible sections that can fold into 3D configurations, this board enables the miniaturization of smartwatches, fitness trackers, hearables, and compact IoT sensors. The construction features a 25µm polyimide core with adhesiveless construction, supporting 90° to 180° bending