IC Substrate Board
High Tg Low CTE BT IC Substrate For Memory And Mobile AP Packages Thermal Stability
BT (Bismaleimide Triazine) resin substrates, originally developed by Mitsubishi Gas Chemical, represent the dominant substrate material for semiconductor IC packaging. Over 70% of organic IC package substrates use BT-based laminate systems. This high-performance thermoset polymer combines a high glass transition temperature (Tg) of 185-225°C with ultra-low moisture absorption (0.3-0.5%) and low dielectric constant (Dk 3.4-4.0 @ 1 GHz), enabling reliable signal routing between
High Density Fine Line BT IC Substrate for Advanced FC-CSP and WB-BGA Packages
BT IC substrate product line is engineered for advanced package formats including FC-CSP (Flip Chip Chip Scale Package) and WB-BGA (Wire Bond Ball Grid Array). BT resin, with its high glass transition temperature (180-225°C), low moisture absorption (0.3-0.5%), and fine-line capability (10/10 μm), enables high-density interconnection for memory controllers, RF modules, and mobile application processors. The substrate redistributes fine-pitch die bumps (40-130 μm pitch) to the
High Frequency Low Loss BT IC Substrate for 5G RF Modules and Antenna in Package Applications
BT IC substrate is specifically engineered for high-frequency 5G RF modules, Antenna-in-Package (AiP), and millimeter-wave communication applications. Modified BT resin systems achieve dissipation factor (Df) as low as 0.005 @ 28 GHz through spherical silica-filled formulations. These substrates support 14-layer any-layer structures with embedded bandpass impedance transformers for compact 28 GHz AiP modules . With stable dielectric properties across frequency (Dk 3.4-4.0 ,
High Reliability Automotive Grade BT IC Substrate for MCU and Sensor Applications
BT IC substrate is engineered for automotive electronics requiring AEC-Q100 Grade 2 compatibility and extended temperature cycling reliability. BT resin's high glass transition temperature (180-225°C), low CTE (12-16 ppm/°C), and ultra-low moisture absorption (0.3-0.5%) provide the thermal and mechanical stability demanded by under-hood control modules, radar systems, and high-temperature environments. Available in 2-12 layer configurations with line/space down to 10/10 μm
High Density Coreless ETS BT IC Substrate for Ultra-Thin FC-CSP and SiP
Coreless ETS (Embedded Trace Substrate) BT IC substrate eliminates the thick glass-cloth reinforced core to achieve ultra-thin profiles (as thin as 0.13 mm for 2-6 layer structures) and superior warpage control. By embedding the outermost circuit pattern directly into the BT insulating material, ETS technology enables fine line/space down to 12/12 μm (sample) and 12/18 μm (mSAP production). The coreless construction reduces overall package height for FC-CSP applications (3*3