BGA Test Socket
Zero Footprint Memory Test Socket for DDR3/DDR4/DDR5 with BGA254 Compatibility and Space-Saving Interposer Design
Universal memory testing solution featuring zero-footprint interposer design that eliminates PCB cutouts. Available in F and F1 models for continuity testing and signal analysis. Compatible with DDR3, DDR4, DDR5 and multiple BGA packages including BGA254, BGA315 for efficient IC validation and production testing.
BGA200 LPDDR Test Socket with Zero-Footprint Design for LPDDR4/5 - 10,000+ Cycle Durability
Ultra compact LPDDR test socket featuring direct solder mount with zero-footprint design. Supports BGA200 packages with 10,000+ insertion cycles. Available in F Series for direct contact and F1 Series with test points for signal analysis. Ideal for memory manufacturers, validation labs, and R&D teams requiring high-speed LPDDR4/5 performance validation.
eMMC Test Socket BGA100 BGA153 Zero Footprint Design 10,000+ Cycles for Memory Chip Testing
High-performance zero-footprint eMMC test sockets for BGA100 and BGA153 packages. Direct-solder design requires no PCB modifications, supports eMMC 5.1 and UFS interfaces, and provides over 10,000 mating cycles. Ideal for production testing, R&D validation, and signal analysis applications.
Zero Footprint eMMC Test Socket BGA162/BGA169/BGA254 - 10,000+ Cycles -40°C to +125°C
High-performance direct-solder test sockets for eMMC memory validation. Features zero-footprint design eliminating PCB modifications, 10,000+ insertion cycles, -40°C to +125°C operating range, and gold-plated contacts. Available in Standard F Series and Advanced F1 Series with integrated test points for comprehensive testing capabilities.
BGA221 eMCP Test Socket - Zero Footprint Design with 0.5mm Pitch and 10,000+ Cycles
High-density eMCP test socket for BGA221 packages featuring zero-footprint design requiring no PCB modifications. Supports LPDDR+NAND stacked packages with 4266Mbps signal integrity, gold-plated contacts for 10,000+ test cycles, and compact 2.5mm profile. Ideal for memory validation in manufacturing and repair applications.
Custom BGA Test Socket 0.3-1.5mm Pitch with 50,000+ Cycles for IC Testing -55°C to +140°C
High-performance BGA test sockets with 0.3-1.5mm pitch range and -55°C to +140°C temperature support. Features 50,000+ insertion cycles,