IC Test Sockets
Open Top Programming IC Test Socket High Temperature 130°C for BGA QFN CSP Packages with 30K-50K Insertion Cycles
Premium open top burn-in test sockets designed for high-temperature operation up to 130°C, featuring 30K-50K insertion cycles and customizable configurations for BGA, QFN, and CSP packages. Optimized for automated test equipment integration with robust construction for demanding semiconductor testing environments.
Multi DUT Socket Simultaneous IC Test Sockets for 4-16+ Device Parallel Testing with 50Ω Impedance
High-density Multi-DUT test sockets enable simultaneous testing of 4, 8, or 16+ ICs, boosting throughput and efficiency. Features 30K-50K insertion cycles,
High Cycle ATE IC Test Sockets 30K-50K Insertions for DDR5/LPDDR5 Memory Testing
Precision ATE IC test sockets engineered for high-speed DDR5/LPDDR5 memory validation with 30,000-50,000 insertion cycles. Features ultra-low skew, minimal crosstalk, stable 50Ω impedance, and broad package compatibility. Ideal for data centers, AI accelerators, and automated production testing environments.
ATE Engineering Validation IC Test Sockets 500+ Pin Count 50K Cycles for Automated Testing Equipment
High-pin-count ATE validation sockets with 500+ pin capacity and 50,000+ cycle durability. Features low inductance (
ATE IC Test Sockets for Memory Testing - 30K-50K Insertion Cycles, ±0.01mm Tolerance
High-performance ATE IC test sockets designed for automated final test applications. Features precision pogo pin contacts, 30K-50K insertion cycles, broad package compatibility (BGA, QFN, SOP), and custom configurations for DRAM, Flash, and SoC testing. Ideal for high-volume production with reliable electrical performance.
Durable Clamshell Socket for High Temperature +125°C and 85% RH Aging Tests with 30K-50K Insertion Cycles
Rugged clamshell IC sockets engineered for demanding high-temperature (+125°C+) and high-humidity (85% RH) aging tests. Features reinforced hinges, sealed housings, and choice of pogo pin or spring probe contacts. Supports BGA, QFN, SOP packages with custom configurations for precision testing applications.
Custom IC Test Socket with 500K+ Cycle Durability and ±0.01mm Tolerance for BGA QFN SOP Package Testing
ISO9001-certified custom test sockets engineered for precision IC testing. Features 500,000+ insertion cycles,
Spring Probe Pogo Pin IC Test Socket 500K+ Cycles with <50mΩ Resistance for BGA QFN Packages
High-performance IC test sockets with spring probe and pogo pin contacts delivering
Open Top Heat Dissipation Semiconductor Test Socket 150°C+ Operation 30K-50K Insertion Cycles
High-temperature test socket designed for stable operation up to 150°C+ with superior heat dissipation. Features 30K-50K insertion cycles,
Precision IC Chip Test Sockets with 30K-50K Insertion Cycles and ±0.01mm Tolerance for BGA QFN SOP Semiconductor Testing
High-performance IC test sockets engineered for reliable semiconductor validation with ≥30K-50K insertion cycles, contact resistance
Highly Customizable IC Test Sockets Featuring Spring Loaded Pins Or Pogo Pins With Thermal Solution For Testing Performance
Product Description: Our IC Test Sockets are precision-engineered solutions designed specifically for Electronic Components Testing Sockets applications, providing reliable and efficient connectivity for semiconductor devices during testing procedures. These Semiconductor Test Sockets are essential in ensuring accurate performance verification of integrated circuits (ICs) across a wide range of package types, including BGA (Ball Grid Array), QFP (Quad Flat Package), SOP
Customized ZIF PGA Socket with 50,000+ Insertion Cycles and <10mΩ Contact Resistance for IC Testing
Precision PGA test socket featuring Zero Insertion Force (ZIF) technology with 50,000+ insertion cycles and
4-Wire Kelvin Test Socket for Low Resistance Testing with <10mΩ Contact Resistance and DC to 6GHz+ Frequency Range
Precision Kelvin test socket using true 4-wire technology for accurate low resistance measurements. Features gold-plated spring probes with
Custom IC Test Socket for BGA QFN SOP Packages - 30K-50K Cycles, 0.3mm to 1.27mm Pitch Options
Professional IC test sockets for BGA, QFN, and SOP packages with multiple lid styles including flip-top, rotating knob, and thermal management options. Features 30K-50K insertion cycles, contact force of 20-30g/pin, and operating temperatures from -55°C to +130°C. Custom designs available for extreme environments and high-frequency applications up to 67GHz.