BGA Substrate
OEM ODM IC Substrate Manufacturing - 1mil Line Width, 0.3mm Thickness, 1-6 Layer Customization
Professional IC substrate manufacturing with 1mil minimum line width and 0.3mm finished thickness. Customizable 1-6 layer designs using premium materials including SHENGYI and Mitsubishi. Supports wire bonding, embedded memory, and RF modules with 600,000 SQM annual capacity. Complete technical support for semiconductor packaging applications.
BT Wire Bonding Substrate 30um L/S ENEPIG ENIG Hard Gold Soft Gold UL IC Substrate
High-density IC substrate with 30um line/space, supporting ENEPIG, ENIG, hard gold, and soft gold finishes. UL certified, ideal for memory packages like DRAM and SSD. Customizable layers, thickness, and surface finish. Reliable quality with global shipping.
MGC BT CSP IC Substrate 1-6 Layer 25um Line Space Memory Package Substrate
High-density BT substrate for memory packaging (DRAM/SSD/LPDDR). Supports 1-6 layers, 25um L/S, immersion gold finish. Custom options available. HOREXS quality with 600,000 SQM annual capacity.
IC Substrate Production 4 Layer Buildup for Memory Package Substrate 25um Line Space
HOREXS manufactures high-quality IC substrates with 25um line/space, 1-6 layer buildup, and BT materials. Supports memory packages like DRAM, SSD, and LPDDR. Custom surface finishes and soldermask available. Certified manufacturer with 600,000 SQM annual capacity.
ENEPIG ENIG Soft Gold Package Substrate Custom 1-6 Layer BT Substrate
High-quality COB package substrate for memory and semiconductor packaging. Supports 1-6 layers, BT material, and ENEPIG finish. Features fine line/space down to 1mil, customizable options, and cost-effective manufacturing from a leading Chinese IC substrate manufacturer.