IC Sockets
High reliability chip carrier socket 3M 8452-21B1-RK-TR with molded slots and optional PCB locating posts
Product Overview The 3M Chip Carrier Sockets, Surfacemount 8400 Series, are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
single inline package socket with glass filled polysulfone insulation and beryllium copper contacts 3M 224-5809-00-0602
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages on .100" [2.54 mm] centers. These sockets can be used in sets to create configurations for non-standard leaded packages on 100 [2.54 mm] centers. Featuring a lever-actuated zero insertion force mechanism, they accept pins up to .025 [0.6 mm] square. The socket contact point is located .085 [2.2 mm] below the top surface of the socket. Available in SIP pin counts from 10
Chip Carrier Socket Surfacemount 3M 8452-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
3M Chip Carrier Sockets Surfacemount 8400 Series Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for compatibility with automated loading equipment. The open-top design ensures unrestricted airflow, while molded
Single in line package sockets with 3M 210 2599 00 0602 zero insertion force lever actuated design
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages on .100" [2.54 mm] centers. These sockets can be used in sets of two or more to accommodate non-standard leaded packages. Featuring a lever-actuated zero insertion force mechanism, they accept pins up to .025" [0.6 mm] square. The socket contact point is located .085" [2.2 mm] below the top surface of the socket. These sockets are suitable for applications requiring SIP
Chip Carrier Socket 3M 8432-21B1-RK-TP Surfacemount Design Suitable for IR Reflow and Wave Soldering
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
Surfacemount Chip Carrier Socket 3M 8468-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are