IC Sockets
Industrial 3 way ball valve BOOMELE Boom Precision Elec IC 32P engineered for consistent flow control
Product Overview The 1000 Series 3-Way Ball Valve is designed for reliable operation in various industrial applications. It offers versatile flow control with its 3-way configuration, allowing for mixing or diverting of media. Constructed with durable materials, this valve is built for longevity and performance in demanding environments. Product Attributes Brand: APCO Series: 1000 Type: 3-Way Ball Valve Technical Specifications Model Size Pressure Rating (PSI) End Connections
BOOMELE Boom Precision Elec IC 28P connector designed for robust industrial operation and durability
Product Overview This product is designed for efficient and reliable operation, offering a robust solution for various industrial applications. Its construction prioritizes durability and performance, making it a valuable asset in demanding environments. Product Attributes Brand: Not specified Origin: Not specified Material: Not specified Color: Not specified Technical Specifications Specification Value Model Not specified Dimensions Not specified Voltage Not specified Weight
Industrial Grade Connector Amphenol DILB28P-223TLF Designed for Enhanced Durability and Reliability
Product Overview This product is designed for specific applications, offering a reliable solution with key benefits and advantages. Its usage scenarios are tailored to meet industrial demands. Product Attributes Brand: Not specified Origin: Not specified Material: Not specified Color: Not specified Technical Specifications Specification Value Model Not specified Dimensions Not specified Voltage Not specified Weight Not specified Ratings Not specified 2504161010_Amphenol
Robust construction Amphenol DILB8P-223TLF designed for performance in industrial environments
Product Overview This product is a high-performance component designed for various applications. Its robust construction and reliable operation make it suitable for demanding industrial environments. Key benefits include durability and efficient performance. Product Attributes Brand: Not specified Origin: Not specified Material: Not specified Color: Not specified Technical Specifications Specification Value Model Not specified Revision D Status Released Printed Date Aug 04,
Connector Amphenol 69802-432LF lead free design compatible with sockets and in different pin counts
Product Overview This product is designed for electronic applications, offering various configurations and packaging options. It is suitable for use with sockets and is available in different pin counts. The product is manufactured with lead-free components. Product Attributes Lead Free (LF) Technical Specifications Part Number Description Unit Pitch (CM) No. of Pin. PCS/REEL REEL/CARTON TOTAL (PCS) G.W. (KG) N.W. (KG) PACKAGING 69802-X32X PACKING FOR 32P & 44P CM 36 32
Lead free electrical connector Amphenol 69802-132LF offering packaging in tape reel PVC tube and PE bags
Product Overview This product is designed for electrical connections, offering various configurations and packaging options. It is suitable for applications requiring specific contact arrangements and is available in lead-free (LF) versions. The product is part of the 69802 series and is offered with different packaging methods, including tape & reel, PVC tube, and PE bags. Product Attributes Lead Free (LF) Technical Specifications Part Number Description No. of Contacts Reel
Gold plated lever operated 40 pin ZIF socket Adafruit Industries 383 designed for easy chip insertion and removal
Product Overview This 40-pin ZIF (Zero Insertion Force) socket is designed for easy insertion and removal of chips from existing circuits, making it ideal for chip programmers or testing applications where chip protection is paramount. The socket features a lever mechanism that allows chips to be inserted when the lever is up and securely latched when the lever is down. It is suitable for DIP chips up to 40 pins and up to 0.6" in width. This ZIF socket can snap into existing
SIP Socket Connector 3M 232-2601-00-0602 with Beryllium Copper Contacts and Polysulfone Insulation
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages on .100" [2.54 mm] centers. These lever-actuated, zero insertion force sockets can be used in sets to create custom sockets for non-standard leaded packages. They accept pins up to .025" [0.6 mm] square and offer a contact point of .085" [2.2 mm] below the top surface of the socket. Available in SIP pin counts from 10 through 36 leads. Product Attributes Brand: 3M
Chip Carrier Socket Surfacemount 8400 Series Featuring 3M 8432-21B1-RK-TR for JEDEC MO-047 and MO-052
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 (square) and MO-052 (rectangular). These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are available. This
Four row through hole chip carrier socket with copper alloy contacts and RoHS compliance 3M 8420-11B1-RK-TP
Product Overview The 3M Chip Carrier Sockets, 8400 Series, are low-profile, four-row, through-hole sockets designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. They are suitable for wave soldering but not for reflow soldering. These sockets are RoHS
High Reliability Surfacemount Chip Carrier Socket 3M 8452-21B1-RK-TP for Automated Loading Equipment
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
QFN test sockets including 3M 264-4205-00 designed for 0.4 mm and 0.5 mm pitch package testing
Product Overview The 3M Textool Open-Top Sockets for QFN Applications are designed for testing and burn-in of Quad Flat No-lead (QFN) packages. This product family includes sockets for 0.4 mm and 0.5 mm pitch QFN devices, utilizing a common contact for both pitch offerings. These sockets are engineered for reliable performance in demanding test environments, as demonstrated by evaluation reports focusing on actuation force, contact force, IC containment, and low-level contact
Surface mount chip carrier socket 3M 8468-21B1-RK-TR featuring RoHS compliance and alignment packaging options
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
Surfacemount chip carrier socket compatible with IR reflow wave soldering and featuring open top design 3M 8428-21B1-RK-TR
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are compatible with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB
Chip carrier sockets low profile four row through hole with molded slots and matte tin wiping area plating 3M 8432-11B1-RK-TP
Product Overview The 3M Chip Carrier Sockets, 8400 Series, are low-profile, four-row, through-hole sockets designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets are compatible with automated loading equipment and feature an open top design for unrestricted airflow and molded slots for easy device extraction. They are wave solder compatible but not suitable for reflow soldering and are RoHS Compliant.
High Temperature Resistant Chip Carrier Socket 3M 8484-21B1-RK-TP with Open Top Design and RoHS Compliance
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are also compatible with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating
3M 8420-21B1-RK-TR chip carrier socket with glass filled polyphenylene sulfide insulation and RoHS compliance
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are suitable for automated loading equipment. The open-top design promotes unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
Durable 3M 8432-21A1-RK-TP chip carrier socket with nickel underplating and optional PCB locating posts
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for compatibility with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction.
Surfacemount Chip Carrier Socket 3M 8484-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts
Surface Mount Chip Carrier Socket 3M 8444-21B1-RK-TR Designed for Automated Loading Equipment
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular formats. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are suitable for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are