IC Sockets
SIP sockets with .100 inch center spacing and lever actuated zero insertion force 3M 236-6225-00-0602
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages on .100" [2.54 mm] centers. These sockets can be used in sets of two or more to accommodate non-standard leaded packages. Featuring a lever-actuated zero insertion force mechanism, they accept pins up to .025" [0.6 mm] square. The socket contact point is located .085" [2.2 mm] below the top surface of the socket. These sockets are suitable for applications requiring SIP
Single in line package sockets with lever actuated zero insertion force mechanism 3M 220 2600 00 0602
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages (SIPs) on .100" [2.54 mm] centers. These sockets offer a lever-actuated zero insertion force mechanism for ease of use and can be combined to create sockets for non-standard leaded packages. They accept pins up to .025" [0.6 mm] square and are suitable for applications requiring SIP pin counts from 10 through 36 leads. Product Attributes Brand: 3M Textool Insulation
Four row low profile chip carrier sockets compatible with automated loading equipment and wave soldering 3M 8468-11B1-RK-TP
Product Overview The 3M Chip Carrier Sockets, 8400 Series, are low-profile, four-row, through-hole sockets designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. They are suitable for wave soldering but not for reflow soldering. The product is RoHS
electrical interconnect solution featuring 3M 929974-01-09-RK boardmount socket with tuning fork contact design
Product Overview The 3M Boardmount Socket 929 Series offers a reliable interconnect solution with a .100" and .100" x .100" pitch. Designed for straight solder tails, these sockets feature a tuning fork contact design and solder standoffs to facilitate production wave soldering. An optional board retention feature is available for enhanced mechanical stability. These sockets are suitable for applications requiring robust electrical connections and are compatible with specific
Open top BGA sockets 3M 7100148803 with excellent airflow and wide package thickness accommodation
Product Overview The 3M Textool 0.65 mm pitch, Open Top, BGA Test & Burn-In Sockets (Type II) are designed for reliable testing and burn-in of BGA devices. These sockets accommodate a wide range of package thicknesses without adaptation, ensuring excellent air flow around the device. Featuring a retractable locating guide for easy board mounting and compatibility with most robotic handlers, they offer easy manual operation. The double beam contact system delivers balanced,
Chip Carrier Socket Low Profile Four Row Through Hole Compatible with Automated Loading 3M 8484-11B1-RK-TP RoHS Compliant
Product Overview The 3M Chip Carrier Sockets, 8400 Series, are low-profile, four-row, through-hole sockets designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. They are suitable for wave soldering processes only and are RoHS Compliant. Product Attributes
Surface mount chip carrier socket 3M 8468-21B1-RK-TP with copper alloy contacts and matte tin plating
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts
Surfacemount Chip Carrier Socket 3M 8444-21A1-RK-TP Compatible with JEDEC MO-047 and MO-052 Designs
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular applications. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are compatible with automated loading equipment. The open-top design allows for unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts
Low Profile Four Row Through Hole Chip Carrier Socket 3M 8444-11B1-RK-TP Compatible with JEDEC MO-047 and MO-052
3M Chip Carrier Sockets - Low Profile, Four-Row, Through Hole 8400 Series Product Overview The 3M Chip Carrier Sockets, 8400 Series, are designed for reliable interfacing with chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These low-profile, four-row, through-hole sockets are compatible with automated loading equipment, featuring an open top design for unrestricted airflow and molded slots for easy device extraction. They are
High Reliability SIP Sockets 3M 220-2600-50-0602 Lever Actuated with Custom Configuration Capability
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages (SIPs) on .100" [2.54 mm] centers. These lever-actuated, zero insertion force sockets can be combined to create custom configurations for non-standard leaded packages. They accept pins up to .025" [0.6 mm] square and feature a contact point .085" [2.2 mm] below the top surface of the socket. Available in SIP pin counts from 10 through 36 leads. Product Attributes Brand:
Chip Carrier Socket 3M 8420-21A1-RK-TP with High Temperature Insulator and Matte Tin Contact Plating
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are also compatible with automated loading equipment. The open-top design facilitates unrestricted airflow, while molded slots allow for easy device extraction. Optional
Four Row Through Hole Low Profile Chip Carrier Socket 3M 8428-11B1-RK-TP Matte Tin Wiping Area Plating
3M Chip Carrier Sockets Low Profile, Four-Row, Through Hole 8400 Series The 3M Chip Carrier Sockets, 8400 Series, are designed for through-hole mounting and offer a low-profile, four-row configuration. These sockets accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. They are compatible with automated loading equipment and feature an open-top design for unrestricted airflow and molded slots for easy device extraction. These
Surfacemount Chip Carrier Socket 3M 8428-21A1-RK-TP with High Temperature Insulator and Molded Slots
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for automated loading equipment. The open-top design allows for unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating
electronic socket with nickel underplated copper alloy contacts and tuning fork design 3M 929974-01-15-RK
Product Overview The 3M Boardmount Socket, 929 Series, offers a reliable interconnect solution with a .100" and .100" x .100" pitch. Featuring a tuning fork contact design and solder standoffs for efficient wave soldering, these sockets are available in single-row configurations from 1 to 40 contacts and double-row from 2 to 80 contacts. An optional board retention feature enhances assembly security. These sockets are designed for a maximum ambient temperature of 65C and a
Surfacemount Chip Carrier Socket 3M 8428-21B1-RK-TP with Molded Slots and Optional PCB Locating Posts
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts
Chip Carrier Socket Surfacemount 3M 8444-21B1-RK-TP Compatible with JEDEC MO-047 and MO-052 Devices
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outlines MO-047 for square and MO-052 for rectangular devices. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering processes, and are compatible with automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating
Chip Carrier Socket 3M 8420-21B1-RK-TP Surface Mount 8400 Series with High Temperature Insulator and RoHS Compliance
Product Overview The 3M Chip Carrier Sockets Surfacemount 8400 Series are designed to accept chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular configurations. These sockets feature a high-temperature insulator compatible with IR reflow and wave soldering, and are designed for automated loading equipment. The open-top design ensures unrestricted airflow, while molded slots facilitate easy device extraction. Optional PCB locating posts are
Lever actuated zero insertion force sockets 3M 210-2599-50-0602 for SIP pin counts from 10 through 36 leads
Product Overview The 3M Textool ZIP Strip Sockets are in-line sockets designed for single-in-line packages (SIPs) on .100" [2.54 mm] centers. These lever-actuated, zero insertion force sockets can be used in sets to accommodate non-standard leaded packages. They are suitable for SIP pin counts ranging from 10 through 36 leads and accept pins up to .025" [0.6 mm] square. The socket contact point is located .085" [2.2 mm] below the top surface of the socket. Product Attributes
Low Profile Four Row Through Hole Chip Carrier Sockets 3M 8452-11B1-RK-TP Compatible with JEDEC MO-047 and MO-052
3M Chip Carrier Sockets - Low Profile, Four-Row, Through Hole 8400 Series Product Overview The 3M Chip Carrier Sockets, 8400 Series, are designed for through-hole mounting and offer a low-profile solution for accepting chip carriers conforming to JEDEC outlines MO-047 (square) and MO-052 (rectangular). These sockets are compatible with automated loading equipment and feature an open-top design for unrestricted airflow. Molded slots facilitate easy device extraction. They are
Durable 3M 2256-9357-0A-2401 BGA Burn-In Socket with Excellent Airflow and Balanced Contact Forces
3M Textool BGA Test & Burn-In Sockets Product Overview 3M Textool BGA Test & Burn-In Sockets, with a 1.00 mm pitch, are designed for reliable testing and burn-in applications of Ball Grid Array (BGA) devices. These open-top sockets feature a double-beam, normally-closed contact design that provides balanced, opposing forces to the solder ball, minimizing shear stress and producing only slight indentations with minimal ball deformation. They offer excellent airflow around the