High Density Interconnect HDI PCBA for Miniaturized Electronics and Advanced Packaging
This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates
This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates sequential lamination, laser drilling, and advanced plating techniques to achieve the interconnect density required by today's most advanced semiconductor packages.
Technical Specifications| Parameter | Specification |
|---|---|
| Technology | High Density Interconnect (HDI) |
| Minimum Line Width/Space | 0.075mm / 0.075mm |
| Minimum Via Diameter | 0.1mm (laser microvia) |
| Via Types | Blind, Buried, Stacked, Staggered |
| Layer Structure | Sequential build-up (1+N+1, 2+N+2, etc.) |
| Board Types | Rigid, Flex, Rigid-Flex |
| Component Types | Fine-pitch BGAs, CSPs, POPs |
| Application Areas | Smartphones, AI modules, Memory, HPC |
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