Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process
RUBIN F 2000 Dye-Based Acid Copper Process Performance & Features Dye-system acid copper plating additive. Low internal stress and excellent ductility of deposits. Wide temperature tolerance, stable operation above 30 ℃. Outstanding leveling and throwing power. Operating Parameters Item Concentration Range Copper Sulfate Pentahydrate (CuSO₄·5H₂O) 195–255 g/L Pure Sulfuric Acid (SG=1.84 g/mL) 27–38 mL/L Chloride Ion (Cl⁻) 80–150 mg/L 2000 Make-Up Agent 8–10 mL/L 2000 A Leveler
Operating Temperature
20-30 ℃
Place of Origin
China
Copper Sulfate Pentahydrate
195-255 g/L
Packaging Details
25kg/drum
Model Number
2000
Pure Sulfuric Acid
27-38 mL/L
Product Description
RUBIN F 2000 Dye-Based Acid Copper Process
Performance & Features
- Dye-system acid copper plating additive.
- Low internal stress and excellent ductility of deposits.
- Wide temperature tolerance, stable operation above 30 ℃.
- Outstanding leveling and throwing power.
Operating Parameters
| Item | Concentration Range |
|---|---|
| Copper Sulfate Pentahydrate (CuSO₄·5H₂O) | 195–255 g/L |
| Pure Sulfuric Acid (SG=1.84 g/mL) | 27–38 mL/L |
| Chloride Ion (Cl⁻) | 80–150 mg/L |
| 2000 Make-Up Agent | 8–10 mL/L |
| 2000 A Leveler | 0.4–0.6 mL/L |
| 2000 B Brightener | 0.3–0.6 mL/L |
| Operating Temperature | 20–30 ℃ |
| Cathode Current Density | 1–6 A/dm² |
| Anode Current Density | 0.5–2.5 A/dm² |
| Anode Material | Phosphor copper balls (0.03–0.06% P) |
| Operating Voltage | 1.0–6.0 V |
| Agitation | Air agitation + mechanical agitation |
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