DS-111 Pyrophosphate Copper Pre Plating Process High Current Efficiency
DS-111 Pyrophosphate Copper Pre-Plating Process Performance & Features The coating boasts strong adhesion to substrates. It can be used for direct plating or strike plating on steel, and delivers excellent coatings on aluminum alloy and zinc alloy. Serves as an underlayer for acid copper, nickel, tin, silver and gold plating. Outstanding comprehensive performance including superior throwing power, high current efficiency, pore-free and compact deposits. Simple bath compositio
pH Value
10-11
Payment Terms
T/T
Operating Temperature
40-60 ℃
Type
Pyrophosphate Copper Pre-Plating
Place of Origin
China
Delivery Time
5-8 work day
Product Description
DS-111 Pyrophosphate Copper Pre-Plating Process
Performance & Features
The coating boasts strong adhesion to substrates. It can be used for direct plating or strike plating on steel, and delivers excellent coatings on aluminum alloy and zinc alloy.
- Serves as an underlayer for acid copper, nickel, tin, silver and gold plating.
- Outstanding comprehensive performance including superior throwing power, high current efficiency, pore-free and compact deposits.
- Simple bath composition, easy maintenance and stable solution.
- Eco-friendly, safe operation and simple wastewater treatment.
- Compatible with cyanide alkaline copper baths for direct tank conversion.
Operating Parameters
| Item | Working Range (Rack Plating) |
|---|---|
| Copper Pyrophosphate | 20–40 g/L |
| DS111 Complexing Agent | 160–200 g/L |
| Potassium Sodium Tartrate | 25–30 g/L |
| Alkaline Copper Brightener | 4–6 mL/L |
| Operating Temperature | 40–60 ℃ |
| pH Value | 10–11 |
| Anode Material | Electrolytic copper plate |
| Agitation | Air agitation + circulation filtration |
Recommended Products
Price: Negotiable
Price: Negotiable
Interested in this product?
Contact us now for more details and a custom quote.