Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance

Name: Stable High Leveling Acid Copper Plating Additives With High Impurity Tolerance
Brand: Wuhan Aobong Surface Technique Co., Ltd.

R·G-910 High Leveling Acid Copper Plating Additive Performance & Features Innovative ultra-high concentrated composite formula with leveling power up to 95%. Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility. Extremely stable plating solution, crystal clear bright surface without fogging. High impurity tolerance and long bath service life. Operating Parameters Item Concentration Range Copper Sulfate Pentahydrate (CuSO₄·5H₂O) 160–210 g

Operating Temperature 20-30 ℃

Copper Sulfate Pentahydrate 160-210 g/L

Place of Origin China

Packaging Details 25kg/drum

Model Number R·G-910

Pure Sulfuric Acid 50-70 g/L

swimsuit high waist bikini bottom high waist high speed micro centrifuge

Product Description

R·G-910 High Leveling Acid Copper Plating Additive

Performance & Features

Innovative ultra-high concentrated composite formula with leveling power up to 95%.
Easy bath control; coatings free of pinholes, low internal stress and ultra-high ductility.
Extremely stable plating solution, crystal clear bright surface without fogging.
High impurity tolerance and long bath service life.

Operating Parameters

Item	Concentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O)	160–210 g/L
Pure Sulfuric Acid (Specific gravity=1.84)	50–70 g/L
Chloride Ion	60–120 mg/L (ppm)
R·G-910 MU Make-up Agent	4–10 mL/L
R·G-910 A Primary Brightener	0.4–0.8 mL/L
R·G-910 B Primary Brightener	0.3–0.5 mL/L
Operating Temperature	20–30 ℃
Cathode Current Density	1–8 A/dm²
Anode Current Density	0.5–3.0 A/dm²
Anode Material	Phosphor copper balls (0.03–0.06% P)
Agitation	Air agitation or mechanical agitation