Open Top Heat Dissipation Semiconductor Test Socket 150°C+ Operation 30K-50K Insertion Cycles
High-temperature test socket designed for stable operation up to 150°C+ with superior heat dissipation. Features 30K-50K insertion cycles, <50mΩ contact resistance, and compatibility with BGA, QFN, SOP packages. Ideal for power device testing, automotive validation, and extended burn-in applications requiring 200+ hours of continuous operation.
Brand Name
Sireda
Compatible Packages:
BGA, QFN, LGA, SOP, WLCSP
Socket Type
Open Top
Place of Origin
China
Price
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Minimum Order Quantity
1
Product Description
High-Temperature Test Sockets with Superior Heat Dissipation
Advanced Heat Dissipation
Specially designed for stable operation up to 150°C+, preventing thermal drift in power device and automotive testing.
Extended Burn-In Durability
Engineered for 200+ hours of continuous validation with minimal contact degradation.
Key Features & Benefits
- Superior Durability - Built for high-cycle testing with robust materials that withstand thousands of insertions
- Broad Compatibility - Supports BGA, QFN, SOP, and other IC packages
- Precision Contact Technology - Low-resistance spring probes or pogo pins for reliable electrical connections
- Custom Configurations - Tailored test fixtures for unique IC designs and testing requirements
- Thermal & High-Frequency Options - Specialized sockets for burn-in, high-temp, and RF testing
Core Specifications
| Property | Parameter | Typical Value |
|---|---|---|
| Mechanical | Insertion Cycles | ≥30K-50K cycles |
| Contact Force | 20-30g/pin | |
| Operating Temperature | Commercial -40°C to +125°C Military -55°C to +130°C |
|
| Tolerance | ±0.01mm | |
| Electrical | Contact Resistance | <50mΩ |
| Impedance | 50Ω (±5%) | |
| Current | 1.5A-3A |
Precision Testing Solutions
Whether you're validating prototypes, programming ICs, or running high-volume production tests, our custom test sockets ensure accuracy and repeatability. Engineered for challenging environments, our sockets feature robust mechanical designs to prevent warping under thermal stress while maintaining stable contact resistance. Compatible with automated handlers and testers, they streamline your validation process while cutting downtime.
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