China Camera PCB Test Socket Burn In Jig with 0.3mm Pitch Pogo Pins for 10Gbps Signal Debugging and Life Cycle Testing for sale
China Camera PCB Test Socket Burn In Jig with 0.3mm Pitch Pogo Pins for 10Gbps Signal Debugging and Life Cycle Testing for sale

Camera PCB Test Socket Burn In Jig with 0.3mm Pitch Pogo Pins for 10Gbps Signal Debugging and Life Cycle Testing

Precision camera PCB test sockets and burn-in jigs featuring high-density 0.3mm pitch pogo pins for signal integrity validation up to 10Gbps LVDS. Supports automated debugging, thermal stress testing, and high-frequency validation up to 5GHz. Custom adapter boards available for impedance control and interface matching.

Brand Name Sireda
Socket Type Close lid
Place of Origin China
Price Get Quote
Minimum Order Quantity 1
Pitch ≥0.3mm
dry bag camera ip 44 socket steam mop 5 in 1
Product Description
Camera PCB Test Sockets & Burn-in Jigs
Ensure flawless performance of your camera module PCBs with our precision test sockets and burn-in jigs, engineered for comprehensive signal integrity validation and extended thermal stress testing.
High-Density Signal Debugging & Lifecycle Validation
Our camera module testing jigs enable rapid ISP signal validation (I2C/SPI/MIPI) and detect open/short faults in high-speed traces up to 10Gbps LVDS. Featuring high-density pogo pins with 0.3mm pitch support.
Product Images
Camera PCB test socket showing high-density pogo pin configuration Close-up view of camera PCB test socket with fine-pitch contacts
Manual Camera Module Test Sockets
Manual camera module test socket for flexible testing applications Alternative view of manual camera module test socket showing connector interface
Camera Auto-Test Socket
Automated testing solution for high-volume production environments with integrated signal validation capabilities.
Key Technical Features
  • Wide Compatibility - Supports camera modules with FPC gold fingers, BTB connectors, and various pin pitches from 0.5mm down to 0.2mm or finer
  • High-Precision Custom Design - Ensures accurate alignment and optimal conductivity for reliable test performance
  • Durable & Wear-Resistant - Uses high-quality probes or micro-pogo pins for fine-pitch testing, extending operational lifespan
  • Stable & Long-Lasting - Reduces contact resistance and signal loss for repeatable, high-frequency tests up to 5GHz
  • Custom PCB Adapter Boards - Optimized for impedance control and interface matching based on customer requirements
Technical Specifications
Parameter Specification
Pin Pitch Support 0.2mm - 0.5mm (0.3mm standard)
Signal Speed Up to 10Gbps LVDS
Test Frequency Up to 5GHz
Interface Protocols I2C, SPI, MIPI
Connector Types FPC Gold Fingers, BTB Connectors

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