0.15mm Thickness 2-Layer IC Package Substrate for Memory Cards with 0.32mm Finished Thickness and 25μm Line Width
High-performance IC package substrate designed for memory card applications including Micro SD, TF, and UDP cards. Features 0.15mm thickness, 0.32mm finished thickness, and 25μm minimum line width. Supports wire bonding, embedded memory, and advanced packaging technologies with customizable materials and surface finishes from leading manufacturers.
0.15mm thickness 2-layer substrate designed specifically for memory card packaging and IC assembly applications.
- Memory cards (Micro SD, Micro TF, UDP)
- USB devices and chip substrates
- IC assembly substrates and semiconductor packaging
- Wearable electronics and NAND/Flash memory packages
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.32mm |
| Copper Weight | 0.5oz (Customizable) |
| Layer Count | 4 layers (Customizable) |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (Customizable: OSP, immersion silver, tin) |
| Soldermask | Green (Customizable, Brand: TAIYO INK) |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes.
- Line/Space: 20/20μm, 10/10μm
- BT+ABF materials support
- Wire bonding substrates and embedded memory IC substrates
- MEMS/CMOS, RF, Wireless, Bluetooth modules
- 2/4/6 layer configurations with buildup technology
- Substrate production specifications
- Gerber and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
Available shipping methods: DHL, UPS, FedEx, air freight, and customized express services.
Contact HOREXS for competitive pricing and technical support to optimize your IC packaging solutions.
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