25μm Line/Space FBGA Package Substrate for Memory IC - 0.22mm Thickness, 4-Layer Customizable Design
Professional 25μm line/space FBGA package substrate designed for memory IC applications including DDR SDRAM, NAND/Flash, and uMCP modules. Features 0.22mm finished thickness, customizable 4-layer construction, and multiple material options. Ideal for smartphones, servers, automotive electronics, and portable devices with advanced manufacturing capabilities supporting 10/10μm technology.
- Semiconductor packaging and IC substrates
- Memory applications: uMCP, MCP, UFS, DDR SDRAM, NAND/Flash
- Mobile devices: Smartphones, tablets, laptops, wearables
- Computing systems: Servers, workstations, desktop PCs
- Automotive electronics and portable gaming devices
- RF/wireless modules and power/analog ICs
| Parameter | Specification |
|---|---|
| Line Space/Width | 25μm (1 mil) |
| Finished Thickness | 0.22mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), Mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz (customizable) |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green (standard), customizable colors (TAIYO INK brand) |
HOREXS Group operates a 60,000 square meter facility in Hubei province with over $300 million USD investment. Annual production capacity reaches 600,000 square meters using advanced tenting and SAP processes.
Advanced technology supports line/space down to 10/10μm with BT+ABF materials for various IC packaging applications including wire bonding, embedded memory substrates, MEMS/CMOS, and RF modules.
- Complete substrate specification details
- Gerber and drilling files from layout software
- Quantity requirements including samples
- Layer stack-up information for multilayer designs
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for high-volume customers with cost-saving solutions and quality guarantees.
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