4-Layer BT Material IC Substrate - 25μm Line Width, 0.22mm Thickness for Semiconductor Packaging
Advanced 4-layer BT material IC substrate with 25μm minimum line width and 0.22mm finished thickness. Supports uMCP, MCP, UFS, CMOS, MEMS applications with customizable surface finishes and layer configurations. Manufactured by HOREXS with 600,000 SQM annual capacity and technical support for high-volume requirements.
4-layer BT material semiconductor packaging substrate designed for advanced IC applications including uMCP, MCP, UFS, CMOS, MEMS, and various memory packages.
- Smartphones, laptops, tablets, and portable gaming devices
- Power/Analog IC drive and control drive IC for portable electronics
- PDA, wireless RF, memory (DDR SDRAM), cell phones
- Workstations, servers, video cameras, desktop and notebook PCs
- Wearable electronics and NAND/Flash memory packages
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.22mm |
| Material Brands | SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki, OhmegaPly, Ticer, AMC, Isola, AGC, Neclo, Rogers, Taconic |
| Surface Finish | Immersion gold (standard), OSP, immersion silver, tin (customizable) |
| Copper Weight | 0.5oz or customizable |
| Layer Count | 4 layers (customizable) |
| Soldermask | Green (standard) or customizable (TAIYO INK brand) |
HOREXS-Hubei, part of HOREXS Group, is a leading IC substrate manufacturer with over 60,000 square meters of production space and $300 million USD investment. Annual capacity of 600,000 SQM with Tenting & SAP processes. Advanced capabilities include L/S 20/20μm, 10/10μm technology and support for BT+ABF materials.
- Substrate production specification information
- Gerber files and drilling files
- Quantity requirements including samples
- Layer stack-up information for multilayer substrates
DHL, UPS, FedEx, air freight, and customized express services available.
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