Storage IC Package Substrate PCB - 0.1-0.4mm FR4 BGA with 1mil Line Width for Semiconductor Assembly
High-precision storage IC package substrate PCBs featuring 0.1-0.4mm FR4 thickness, 1mil line spacing, and gold plating. Ideal for BGA, UFS, eMMC, and MEMS applications in consumer electronics, wearables, and industrial devices. Manufactured with 99.7% quality yield using Japanese precision equipment.
High-precision BGA substrate PCBs designed for advanced storage IC packaging applications in consumer electronics, wearables, and industrial devices.
| Parameter | Specification |
|---|---|
| Minimum Line Space/Width | 1 mil (25μm) |
| Finished Thickness | 0.1-0.4mm (FR4 material) |
| Copper Weight | 0.5oz standard (customizable) |
| Layers | 1-6 layers (customizable) |
| Surface Finish | Immersion gold (OSP/immersion silver/tin available) |
| Soldermask | Green standard (custom colors available) |
- Semiconductor packaging and IC substrates
- MCP, UFS, CMOS, and MEMS devices
- Storage IC assemblies including eMMC, BGA, UFS
- Consumer electronics, wearables, and UAV systems
- Smart cards, micro SD, SIM cards, and sensor packages
Specialized ultra-thin FR4 PCB manufacturer with Japanese precision equipment ensuring 99.7% quality yield and stable production performance.
- Advanced inspection systems: AVI and AOI
- 3 LDI systems for soldermask and circuit precision
- Mekki brand laminate press machines
- High-precision production equipment from Japan
- Primary brands: SHENGYI, Mitsubishi (BT-FR4), mitsuiseiki
- Specialty materials: OhmegaPly, Ticer, AMC, Isola, AGC
- High-frequency options: Neclo, Rogers, Taconic
- Soldermask brands: TAIYO INK, ABQ
For quotation and production, please provide:
- Complete PCB production specifications
- Gerber files and drilling files
- Quantity requirements (including samples)
- Layer stack-up information for multilayer boards
Global shipping via DHL, UPS, FedEx, and air freight. Technical support available for volume customers and custom requirements.
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